公开(公告)号：US20230132534A1

公开(公告)日：2023-05-04

申请号：US17693459

申请日：2022-03-14

申请人： National Central University

发明人： Jeng-Rong Ho ,  Chih-Kuang Lin ,  Pi-Cheng Tung

IPC分类号： H01L41/332 ,  H03B5/32 ,  H01L41/187 ,  H01L41/338

摘要： An oscillator frequency modulation method includes: providing a piezoelectric material having a surface and an interior; and performing a pattern process on the piezoelectric material by a laser. A patterned processing zone is formed on the surface and/or in the interior of the piezoelectric material. The pattern process may be a material removal and/or a material modification. Therefore, without changing the appearance of the piezoelectric material, the pattern process on the piezoelectric material through the laser can accurately adjust the frequency of the oscillator and block unnecessary mode at the same time. An oscillator piezoelectric structure with frequency modulation is also provided.

公开(公告)号：US11638571B2

公开(公告)日：2023-05-02

申请号：US16358303

申请日：2019-03-19

申请人： Konica Minolta, Inc.

发明人： Kenji Suzuki ,  Yuta Nakayama

IPC分类号： A61B8/00 ,  B06B1/06 ,  H01L41/187 ,  H01L41/193

摘要： An ultrasound probe and ultrasound diagnostic apparatus that achieve high transmission/reception sensitivity and wide frequency band are provided. The ultrasound probe includes a pMUT array in which a plurality of pMUTs are arranged. The pMUTs include first pMUTs for ultrasound transmission and pMUTs for ultrasound wave reception having a structure different from that of the first pMUTs. The cell region of each first pMUT and the cell region of each second pMUT are separated from each other in the ultrasound wave radiation plane.

公开(公告)号：US20230113584A1

公开(公告)日：2023-04-13

申请号：US17938118

申请日：2022-10-05

申请人： SKYWORKS GLOBAL PTE. LTD.

发明人： Kezia Cheng ,  Kwang Jae Shin ,  Alexandre Augusto Shirakawa ,  Stefan Bader

IPC分类号： H01L41/319 ,  H01L41/08 ,  H01L41/187 ,  H01L41/316 ,  H03H9/02 ,  H03H9/17 ,  H03H9/56 ,  H03H9/25 ,  H03H9/64

摘要： A piezoelectric film on a substrate is provided comprising an aluminum nitride (AlN) layer, and a Al1-x(J)xN compound layer comprising a graded section with a lower (J) composition, x, adjacent to the AlN layer and a higher (J) composition, x, located away from the AlN layer, the said (J) being a singular element or a binary compound. A method for forming such a piezoelectric film is also provided. A surface acoustic wave resonator comprising such a piezoelectric film, a surface acoustic wave filter comprising such a piezoelectric film, a bulk acoustic wave resonator comprising such a piezoelectric film, and a bulk acoustic wave filter comprising such a piezoelectric film are also provided.

公开(公告)号：US11616488B2

公开(公告)日：2023-03-28

申请号：US16326590

申请日：2016-09-30

申请人： INTEL CORPORATION

发明人： Sansaptak Dasgupta ,  Paul B. Fischer ,  Han Wui Then ,  Marko Radosavljevic

IPC分类号： H03H9/205 ,  H03H3/02 ,  H03H9/58 ,  H03H9/60 ,  H03H9/17 ,  H01L27/20 ,  H01L41/08 ,  H01L41/187 ,  H01L41/29 ,  H01L41/316 ,  H03H9/02

摘要： An integrated circuit film bulk acoustic resonator (FBAR) device having multiple resonator thicknesses is formed on a common substrate in a stacked configuration. In an embodiment, a seed layer is deposited on a substrate, and one or more multi-layer stacks are deposited on the seed layer, each multi-layer stack having a first metal layer deposited on a first sacrificial layer, and a second metal layer deposited on a second sacrificial layer. The second sacrificial layer can be removed and the resulting space is filled in with a piezoelectric material, and the first sacrificial layer can be removed to release the piezoelectric material from the substrate and suspend the piezoelectric material above the substrate. More than one multi-layer stack can be added, each having a unique resonant frequency. Thus, multiple resonator thicknesses can be achieved on a common substrate, and hence, multiple resonant frequencies on that same substrate.

公开(公告)号：US20230053303A1

公开(公告)日：2023-02-16

申请号：US17791620

申请日：2020-12-18

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Shoji AKIYAMA

IPC分类号： H01L41/187 ,  H01L41/337 ,  H01L41/312 ,  H01L41/27

摘要： A manufacturing method of a composite substrate capable of suppressing damage due to heat treatment after bonding, and a composite substrate manufactured by the method are provided. The manufacturing method of a composite substrate according to the present invention is a manufacturing method of a composite substrate in which a piezoelectric wafer, which is a lithium tantalate wafer or lithium niobate wafer, and a support wafer are bonded together. This manufacturing method is characterized by a step of bonding a piezoelectric wafer and a support wafer, and a step of performing heat treatment of the wafer bonded in the step of bonding, with the non-bonded surface of the piezoelectric wafer being a mirror surface.

公开(公告)号：US20230016891A1

公开(公告)日：2023-01-19

申请号：US17953421

申请日：2022-09-27

申请人： Murata Manufacturing Co., Ltd.

发明人： Masakazu YAMAUCHI ,  Sahutboon KITTAYAWANICH ,  Pongsakorn SURINTUM ,  Shigemasa KUSABIRAKI

IPC分类号： H04R17/00 ,  H01L41/047 ,  H01L41/187 ,  H01L41/09

摘要： A piezoelectric sound generation component is provided that includes a piezoelectric vibration plate, a case with a case body and a lid that accommodates the piezoelectric vibration plate in an inner space formed by the case body and the lid, and a pin terminal provided to the lid so that the pin terminal is abutted on the piezoelectric vibration plate. The case body has a first top wall and a first circumferential wall. The lid has a second top wall, a second circumferential wall, and a protruding portion that contacts the first circumferential wall of the case body. The protruding portion has a first surface that is abutted on a contact surface, facing the first top wall, of the first circumferential wall and a second surface that couples the first surface to the second circumferential wall and is separated from the first circumferential wall.

公开(公告)号：US11557715B2

公开(公告)日：2023-01-17

申请号：US16759992

申请日：2018-10-31

申请人： Soitec

发明人： Bruno Ghyselen ,  Jean-Marc Bethoux

IPC分类号： H01L41/313 ,  H01L21/265 ,  H01L41/187

摘要： A method for manufacturing a film, notably monocrystalline, on a flexible sheet, comprises the following steps: providing a donor substrate, forming an embrittlement zone in the donor substrate so as to delimit the film, forming the flexible sheet by deposition over the surface of the film, and detaching the donor substrate along the embrittlement zone so as to transfer the film onto the flexible sheet.

公开(公告)号：US11557713B2

公开(公告)日：2023-01-17

申请号：US16628524

申请日：2018-06-22

申请人： SUMITOMO CHEMICAL COMPANY, LIMITED

发明人： Kenji Shibata ,  Kazutoshi Watanabe ,  Fumimasa Horikiri

IPC分类号： H01L41/187 ,  H01L41/08 ,  H01L41/27

摘要： There is provided a laminated substrate having a piezoelectric film, including: a substrate; and a piezoelectric film provided on the substrate interposing a base film, wherein the piezoelectric film has an alkali niobium oxide based perovskite structure represented by a composition formula of (K1-xNax)NbO3 (0

公开(公告)号：US11552240B2

公开(公告)日：2023-01-10

申请号：US16571794

申请日：2019-09-16

申请人： Purdue Research Foundation

发明人： Mukerrem Cakmak ,  Armen Yildirim ,  Rahim Rahimi ,  Saeed Mohammadi ,  Ali Shakouri

IPC分类号： H01L41/193 ,  G01L1/18 ,  G01L9/06 ,  H01L41/047 ,  H01L41/187 ,  H01L41/08 ,  H01L41/09 ,  H01L41/113

摘要： A sensor is disclosed which includes a piezoelectric layer, a piezoresistive layer, one or more electrode layers coupled to the piezoelectric layer and to the piezoresistive layer, the piezoelectric layer configured to provide an electrical signal in response to application of a dynamic disturbance, and the piezoresistive layer configured to provide a change in resistivity in response to application of a static disturbance.

公开(公告)号：US11547347B2

公开(公告)日：2023-01-10

申请号：US16152785

申请日：2018-10-05

申请人： Massachusetts Institute of Technology

发明人： Canan Dagdeviren ,  Carlo Giovanni Traverso ,  Robert S. Langer

IPC分类号： A61B5/00 ,  A61B5/07 ,  A61B5/11 ,  H01L41/04 ,  H01L41/047 ,  H01L41/053 ,  H01L41/113 ,  H01L41/187 ,  H01L41/23 ,  H01L41/29 ,  H01L41/333 ,  G01L1/16 ,  G01L19/08 ,  G01L9/00

摘要： Improvements in ingestible electronics with the capacity to sense physiologic and pathophysiologic states have transformed the standard of care for patients. Yet despite advances in device development, significant risks associated with solid, non-flexible gastrointestinal transiting systems remain. Here, we disclose an ingestible, flexible piezoelectric device that senses mechanical deformation within the gastric cavity. We demonstrate the capabilities of the sensor in both in vitro and ex vivo simulated gastric models, quantified its key behaviors in the GI tract by using computational modeling, and validated its functionality in awake and ambulating swine. Our piezoelectric devices can safely sense mechanical variations and harvest mechanical energy inside the gastrointestinal tract for diagnosing and treating motility disorders and for monitoring ingestion in bariatric applications.