公开(公告)号：US20240347993A1

公开(公告)日：2024-10-17

申请号：US18300476

申请日：2023-04-14

申请人： TE Connectivity Solutions GmbH

发明人： Matthew ORLOWSKI ,  Eric BROADAWAY

IPC分类号： H01R43/048 ,  H01R43/02 ,  H01R43/042

CPC分类号： H01R43/048 ,  H01R43/0214 ,  H01R43/042

摘要： A wire terminating system and method which allows for determining the quality of a wire termination. The method includes: terminating the terminal to the wire; monitoring the thermal data of the termination of the terminal to the wire with one or more thermal sensors; and comparing the monitored thermal data to stored thermal data to determine if the termination of the terminal to the wire is defective. The system includes a wire termination apparatus with a thermal sensor is positioned proximate a wire termination zone to acquire thermal data of the termination of the terminal to the wire. The thermal sensor monitors the thermal data of the termination of the terminal to the wire to determine if the termination of the terminal to the wire is defective.

公开(公告)号：US12100915B2

公开(公告)日：2024-09-24

申请号：US18137708

申请日：2023-04-21

申请人： Aptiv Technologies AG

发明人： Gert Droesbeke ,  Tristan de Blieck Roland ,  Srinivasan Manoharan

IPC分类号： H01R13/6593 ,  H01R43/02 ,  H01R43/04 ,  H01R4/10 ,  H01R4/18 ,  H01R9/05 ,  H01R11/11 ,  H01R13/40 ,  H01R13/42 ,  H01R13/422 ,  H01R13/428 ,  H01R13/506 ,  H01R13/6581 ,  H01R13/6591 ,  H01R13/6592 ,  H01R43/20

CPC分类号： H01R13/6593 ,  H01R43/0221 ,  H01R43/04 ,  H01R4/10 ,  H01R4/18 ,  H01R4/184 ,  H01R4/185 ,  H01R4/186 ,  H01R4/187 ,  H01R9/05 ,  H01R9/0518 ,  H01R11/11 ,  H01R13/40 ,  H01R13/42 ,  H01R13/422 ,  H01R13/4223 ,  H01R13/428 ,  H01R13/506 ,  H01R13/6581 ,  H01R13/6591 ,  H01R13/6592 ,  H01R43/02 ,  H01R43/20

摘要： A method of assembling a connector for automotive applications, comprising the steps of: providing a cable having at least one inner conductor; connecting an elongated inner signal contact of the connector to a stripped end of the at least one inner conductor; surrounding the elongated inner signal contact by an insulating element; placing a first shielding part of the connector around a first portion of the insulating element from a first radial direction; placing a second shielding part of the connector around a second portion of the insulating element from a second radial direction generally opposite to the first radial direction; and joining the first and second shielding parts to form a shielding contact of the connector surrounding the insulating element.

公开(公告)号：US12100910B2

公开(公告)日：2024-09-24

申请号：US17457737

申请日：2021-12-06

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Theron Lee Lewis ,  David J. Braun ,  James D. Bielick ,  John R. Dangler ,  Timothy P. Younger ,  Timothy Jennings ,  Jennifer I. Bennett ,  Stephen Michael Hugo

IPC分类号： H01R13/516 ,  H01R12/57 ,  H01R43/02

CPC分类号： H01R13/516 ,  H01R43/0256 ,  F16B2200/77 ,  H01R12/57

摘要： A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.

公开(公告)号：US20240300051A1

公开(公告)日：2024-09-12

申请号：US18563656

申请日：2022-04-27

申请人： Auto-Kabel Management GmbH

发明人： Marie Redder ,  Urszula Bitner ,  Kabelo Sebetlela

IPC分类号： B23K26/26 ,  B23K26/361 ,  B23K26/38 ,  B23K37/04 ,  B23K101/32 ,  B23K101/38 ,  H01R43/02

CPC分类号： B23K26/26 ,  B23K26/361 ,  B23K26/38 ,  B23K37/0435 ,  H01R43/0221 ,  H01R43/0263 ,  B23K2101/32 ,  B23K2101/38

摘要： Method for processing an electrical conductor, in which a bare conductor end of a stranded conductor is provided, the strands of the bare conductor end are gripped at least partially circumferentially by gripping jaws, the strands are at least partially compacted in the region of the conductor end by the gripping jaws, and the compacted strands are welded to one another with the aid of a laser beam source in the region of the gripping jaws, through the gripping jaws.

公开(公告)号：US20240291174A1

公开(公告)日：2024-08-29

申请号：US18658151

申请日：2024-05-08

申请人： HOWMET AEROSPACE INC.

发明人： Donald J. Spinella ,  Daniel Bergstrom

IPC分类号： H01R4/02 ,  B23K11/11 ,  B23K11/20 ,  B23K35/02 ,  B23K103/20 ,  F16B5/08 ,  F16B37/06 ,  H01R4/62 ,  H01R43/02

CPC分类号： H01R4/027 ,  B23K11/11 ,  B23K11/20 ,  B23K35/0288 ,  F16B37/061 ,  H01R43/0214 ,  B23K2103/20 ,  F16B5/08 ,  H01R4/625 ,  Y10T403/472

摘要： An apparatus and method for fastening dissimilar materials like steel, plastic and aluminum. A resistance welding fastener having multiple layers may be used with or without a sealant. The fastener may be used to form an aluminum covered steel laminate via a hemming pattern of attachment. The fastener may have a solid shaft or have an extended reach and have features for interacting with the welding electrode. A variety of electrode tips may be employed to cooperate with the fastener.

公开(公告)号：US20240283170A1

公开(公告)日：2024-08-22

申请号：US18645682

申请日：2024-04-25

申请人： Yazaki Corporation

发明人： Takahiro MATSUO

IPC分类号： H01R4/02 ,  H01R4/18 ,  H01R4/48 ,  H01R43/02

CPC分类号： H01R4/023 ,  H01R4/4821 ,  H01R4/4848 ,  H01R43/0207 ,  H01R4/185

摘要： A connection terminal includes an electric wire connection part to which an electric wire is electrically connected by ultrasonic bonding, and an electric connection part integrated with the electric wire connection part and electrically connected to a mating terminal. The electric connection part includes a box unit which is formed in a cylindrical shape by bending a plurality of bending parts and into which the mating terminal is capable of being inserted, and a thin-walled portion having a thickness less than other parts of the box unit is provided and a plurality of thin-walled portions is arranged on at least one of the bending parts along the bending part.

公开(公告)号：US12068554B2

公开(公告)日：2024-08-20

申请号：US17587818

申请日：2022-01-28

申请人： Hewlett Packard Enterprise Development LP

发明人： Paul Danna ,  Vincent W. Michna ,  Chi Kim Sides

IPC分类号： H05K3/34 ,  H01R12/70 ,  H01R12/71 ,  H01R43/02

CPC分类号： H01R12/716 ,  H01R12/707 ,  H01R43/0256 ,  H05K3/3405

摘要： A dual-path signal interconnect is provided. The interconnect can include a first signal trace, first and second solder pads positioned above and connected to the first signal trace, and a third solder pad. The second solder pad separates from the first solder pad. The third solder pad separates from the second solder pad and is connected to a second signal trace. The first and second solder pads are to allow a pin of a connector to be soldered to the first and second solder pads, such that, when the pin of the external connector is soldered, high-speed electrical signals from the first signal trace are routed to the connector. The second and third solder pads are to allow a conductor to be soldered to the second and third solder pads, such that, when the conductor is soldered, the high-speed electrical signals are routed to the second signal trace.

公开(公告)号：US12057670B2

公开(公告)日：2024-08-06

申请号：US17219613

申请日：2021-03-31

申请人： Advanced Semiconductor Engineering, Inc.

发明人： An-Hsuan Hsu ,  Yung-Sheng Lin

IPC分类号： H01R4/62 ,  H01R12/52 ,  H01R12/57 ,  H01R43/02 ,  H05K3/36 ,  H05K3/10

CPC分类号： H01R4/625 ,  H01R12/52 ,  H01R12/57 ,  H01R43/02 ,  H05K3/368 ,  H05K3/108 ,  H05K2203/0723

摘要： A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first substrate, a second substrate, and a solid solution layer. The first substrate includes a first metal layer, and the first metal layer includes a first metal. The second substrate includes a second metal layer. The solid solution layer electrically connects the first metal layer to the second metal layer. The solid solution layer includes a first metal-rich layer.

公开(公告)号：US12046860B2

公开(公告)日：2024-07-23

申请号：US17308151

申请日：2021-05-05

申请人： OLYMPUS CORPORATION

发明人： Mikio Nakamura ,  Hiroaki Shibuya ,  Takanori Sekido

IPC分类号： H01R43/02 ,  B23K20/10 ,  H01R4/02 ,  H01R12/53 ,  H01R12/57

CPC分类号： H01R4/021 ,  H01R12/53 ,  H01R12/57 ,  H01R43/02 ,  H01R43/0207 ,  B23K20/10 ,  H01R43/0256 ,  Y10T29/49174 ,  Y10T29/49181 ,  Y10T29/49183 ,  Y10T29/49185

摘要： A cable connection structure manufacturing method includes: covering, by a first electrode, an end face of an electric cable, and covering, by a second electrode, a terminal of a substrate; plastically deforming the first electrode and the second electrode having substantially same hardness by first scrubbing in which the first electrode and the second electrode rub against each other at a first pressure and a first amplitude; polishing the first electrode and the second electrode by second scrubbing in which the first electrode and the second electrode rub against each other at a second pressure smaller than the first pressure and a second amplitude smaller than the first amplitude; and bonding the first electrode and the second electrode at a third pressure higher than the first pressure.

公开(公告)号：US12033921B2

公开(公告)日：2024-07-09

申请号：US17706318

申请日：2022-03-28

申请人： Hitachi Metals, Ltd.

发明人： Ryuta Takahashi ,  Hideki Nonen ,  Yuki Yamamoto

IPC分类号： H01L23/49 ,  G02B23/24 ,  H01B11/18 ,  H01B11/20 ,  H01R4/02 ,  H01R4/70 ,  H01R43/02 ,  H04N7/10 ,  H04N7/18

CPC分类号： H01L23/49 ,  G02B23/2484 ,  H01B11/206 ,  H01R4/023 ,  H01R43/0249 ,  H01R43/0263 ,  H04N7/10 ,  H04N7/18 ,  H01B11/1891 ,  H01B11/1895 ,  H01R4/70

摘要： A cable connection structure is provided with an electronic component including electrodes on an electrode-forming surface, a cable including electric wires connected to the electrodes respectively, and a buried member which is composed of a cured resin and embedded with the electric wires. At least three electric wires are separating wires including separating regions being separated from each other in the normal direction as being distant from the electrode-forming surface. At least three electrodes are arranged side by side on a virtual circle. At least three separating wires are connected to the at least three electrodes. The separating regions of the at least three separating wires are provided to be located eccentric radially outwardly in the virtual circle as being distant from the electrode surface in the normal direction of the electrode-forming surface. An angle between the separating region and the normal direction of the electrode-forming surface is 10 degrees or more and 45 degrees or less.