公开(公告)号：US20230084375A1

公开(公告)日：2023-03-16

申请号：US17475123

申请日：2021-09-14

申请人： Intel Corporation

发明人： Priyanka Dobriyal ,  Ankur Agrawal ,  Anna M. Prakash ,  Ann J. Xu ,  Jimin Yao ,  Raiyomand F. Aspandiar ,  Lesley A. Polka Wood ,  Abigail G. Agwai ,  Kayleen L. E. Helms

IPC分类号： H01S5/0237 ,  H01S5/0234

摘要： An apparatus comprising an integrated circuit chip comprising a first surface region and a second surface region adjacent to the first surface region; a substrate coupled to the integrated circuit chip through a plurality of connections comprising solder; and underfill between the substrate and the integrated circuit chip, wherein the underfill contacts the second surface region, but does not contact the first surface region.

公开(公告)号：US11588296B2

公开(公告)日：2023-02-21

申请号：US17130723

申请日：2020-12-22

申请人： NICHIA CORPORATION ,  SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Hidenori Matsuo ,  Masaki Omori ,  Wataru Katayama ,  Ryota Mitsui

IPC分类号： H01S5/02216 ,  H01S5/024 ,  H01S5/0237

摘要： A package for at least one laser diode includes: leads configured to be electrically connected to the at least one laser diode; a base including a mounting surface on which the at least one laser diode is to be mounted and a lateral wall located around the mounting surface so as to surround the at least one laser diode, the lateral wall defining first through-holes and including a light-transmissive part configured to transmit a laser beam emitted from the at least one laser diode; and a lead holding member bonded to the lateral wall of the base and defining second through-holes. The leads are disposed through the first through-holes and the second through-holes. At least a central portion of each of the leads is made of copper.

公开(公告)号：US11437774B2

公开(公告)日：2022-09-06

申请号：US16449126

申请日：2019-06-21

申请人： KYOCERA SLD Laser, Inc.

发明人： Paul Rudy ,  James W. Raring ,  Eric Goutain ,  Troy Trottier ,  Melvin McLaurin ,  James Harrison ,  Sten Heikman ,  Michael Cantore

IPC分类号： H01S5/00 ,  F21K9/64 ,  H01S5/40 ,  F21K9/69 ,  F21K9/68 ,  F21K9/90 ,  F21V29/70 ,  H01S5/343 ,  H01S5/024 ,  H01S5/0237 ,  F21Y115/30 ,  H01S5/02 ,  H01S5/02345 ,  H01L33/00

摘要： The embodiments described herein provide a high-luminous flux laser-based white light source. A plurality of laser packages are arranged in an array pattern on a common support member. The plurality of laser packages each include one or more laser diode devices and a phosphor member. The phosphor member converts a fraction of the electromagnetic radiation from each of the laser diode devices to an emitted electromagnetic radiation and a white light is outputted.

公开(公告)号：US20220200235A1

公开(公告)日：2022-06-23

申请号：US17131548

申请日：2020-12-22

申请人： Beijing Voyager Technology Co., Ltd.

发明人： Yu-Ching Yeh ,  Yue Lu ,  Youmin Wang

IPC分类号： H01S5/024 ,  H05K1/02 ,  H05K7/20 ,  H01S5/042 ,  H01S5/40 ,  H01S5/0237 ,  G01S7/481

摘要： A laser package is mounted on the printed circuit board. At least one thermal via extends through the printed circuit board, coupled to the laser package. A thermal bridge is coupled to the at least one thermal via on the bottom of the printed circuit board. A thermal paste connects the thermal bridge to a conductive ground plane on the bottom of the printed circuit board, and to a mechanical housing.

公开(公告)号：US11264780B2

公开(公告)日：2022-03-01

申请号：US16239083

申请日：2019-01-03

申请人： OEpic SEMICONDUCTORS, INC.

发明人： Yi-Ching Pao

IPC分类号： H01S5/0234 ,  H01S5/042 ,  H01S5/42 ,  H01S5/323 ,  H01S5/024 ,  H01S5/183 ,  H01S5/0237 ,  H01S5/026 ,  H01S5/02345

摘要： A flip chip backside Vertical Cavity Surface Emitting Laser (VCSEL) package has a VCSEL pillar array. A first metal contact is formed over a top section of each pillar of the VCSEL pillar array. A second metal contact is formed on a back surface of the VCEL pillar array. An opening is formed in the second metal contact and aligned with the pillars of the VCSEL pillar array. Solder tip is applied on each pillar of the VCSEL pillar array to flip chip mount the VCSEL pillar array.

公开(公告)号：US11264527B2

公开(公告)日：2022-03-01

申请号：US16148702

申请日：2018-10-01

申请人： Medtronic, Inc.

发明人： Mark R. Boone ,  Mark E. Henschel

IPC分类号： H01L25/16 ,  H01L31/167 ,  H01L25/075 ,  H01L31/12 ,  H01L33/00 ,  H01L33/52 ,  H01L33/62 ,  H01S5/02 ,  H01S5/02208 ,  H01S5/042 ,  H01S5/42 ,  H01S5/0237 ,  H01S5/02234 ,  H01S5/02325 ,  A61B5/00

摘要： Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The integrated circuit package includes first and second active dies. Each of the first and second active dies includes a top contact disposed on the top surface of the die and a bottom contact disposed on a bottom surface of the die. The package further includes a via die having first and second vias that each extends between a top contact disposed on a top surface of the via die and a bottom contact disposed on a bottom surface of the via die, where the bottom contact of the first active die is electrically connected to the bottom contact of the first via of the via die and the bottom contact of the second active die is electrically connected to the bottom contact of the second via of the via die.

公开(公告)号：US11245246B2

公开(公告)日：2022-02-08

申请号：US16308985

申请日：2017-05-31

申请人： OSRAM OLED GmbH

发明人： Wolfgang Reill

IPC分类号： H01S5/042 ,  H01S5/0237 ,  H01S5/065 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/0234 ,  H01S5/0235 ,  H01S5/024

摘要： A semiconductor laser diode includes a semiconductor body having an emitter region; and a first connection element that electrically contacts the semiconductor body in the emitter region, wherein the semiconductor body is in contact with the first connection element in the emitter region, and at least in places in the emitter region, the semiconductor body has a structuring that enlarges a contact area between the semiconductor body and the first connection element.

公开(公告)号：US11156836B2

公开(公告)日：2021-10-26

申请号：US16171212

申请日：2018-10-25

申请人： Google LLC

发明人： Douglas R. Dykaar

IPC分类号： G02B27/01 ,  H04N9/31 ,  H01S5/042 ,  H01S5/02208 ,  G02B26/10 ,  H01S5/40 ,  G02B27/09 ,  G02B27/30 ,  H01S5/0237 ,  H01S5/02253 ,  H01S5/02257 ,  H01S5/02325 ,  H01S5/02345 ,  H01S5/42 ,  H01S5/02251 ,  H01S5/02255

摘要： Systems, devices, and methods for optical engines and laser projectors that are well-suited for use in wearable heads-up displays (WHUDs) are described. Generally, the optical engines of the present disclosure integrate a plurality of laser diodes (e.g., 3 laser diodes, 4 laser diodes) within a single, hermetically or partially hermetically sealed, encapsulated package. The optical engines include an optical director element that includes a curved reflective surface (e.g., parabolic cylinder) that redirects laser light beams and collimates the same along the fast axes thereof. Such optical engines may have various advantages over existing designs including, for example, smaller volumes, better manufacturability, faster modulation speed, etc. WHUDs that employ such optical engines and laser projectors are also described.

公开(公告)号：US20210281039A1

公开(公告)日：2021-09-09

申请号：US17329666

申请日：2021-05-25

申请人： FURUKAWA ELECTRIC CO., LTD.

发明人： Eisaku KAJI ,  Yutaka OHKI

IPC分类号： H01S5/0237 ,  H01S5/023

摘要： A semiconductor-laser-chip-on-submount includes: a semiconductor laser chip that includes a semiconductor portion having an emitting facet and a rear facet along a longitudinal direction and emits laser light from the emitting facet; and a submount where the semiconductor laser chip is mounted. Further, a first distance between the submount and the emitting facet of the semiconductor portion is less than a second distance between the submount and the rear facet of the semiconductor portion.

公开(公告)号：US20210281037A1

公开(公告)日：2021-09-09

申请号：US17240620

申请日：2021-04-26

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Hua Yu ,  An-Jhih Su ,  Chia-Nan Yuan ,  Shih-Guo Shen ,  Der-Chyang Yeh ,  Yu-Hung Lin ,  Ming Shih Yeh

IPC分类号： H01S5/02 ,  H01S5/30 ,  H01S5/026 ,  H01S5/323 ,  H01S5/042 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/02234

摘要： In an embodiment, a device includes: a first reflective structure including first doped layers of a semiconductive material, alternating ones of the first doped layers being doped with a p-type dopant; a second reflective structure including second doped layers of the semiconductive material, alternating ones of the second doped layers being doped with a n-type dopant; an emitting semiconductor region disposed between the first reflective structure and the second reflective structure; a contact pad on the second reflective structure, a work function of the contact pad being less than a work function of the second reflective structure; a bonding layer on the contact pad, a work function of the bonding layer being greater than the work function of the second reflective structure; and a conductive connector on the bonding layer.