Method of manufacturing light emitting device, light emitting device, and base member

    公开(公告)号:US11303095B2

    公开(公告)日:2022-04-12

    申请号:US16791791

    申请日:2020-02-14

    IPC分类号: H01S5/02375 H01S5/00

    摘要: A method of manufacturing a light emitting device, the method including: disposing a first semiconductor laser element on a disposition surface of a base member such that a light emission end surface of the first semiconductor laser element is parallel to a first line passing through a pair of alignment marks provided on the base member; and disposing a first light-reflective member on the disposition surface such that a reference line for the first light-reflective member, which serves as an alignment reference in disposing the first light-reflective member, is parallel to a second line that is oblique to the first line at a predetermined angle.

    LIGHT EMITTING DEVICE
    6.
    发明申请

    公开(公告)号:US20220190553A1

    公开(公告)日:2022-06-16

    申请号:US17688678

    申请日:2022-03-07

    IPC分类号: H01S5/02375 H01S5/00

    摘要: A light emitting device includes one or more electrical components and a base member. The electrical components include a first semiconductor laser element, which has a light emission end surface. The base member has a first surface on which the first semiconductor laser element is disposed. The base member includes a plurality of metal films including a first metal film and a second metal film. The first metal film is electrically connected to at least one of the electrical components, and defines a first alignment mark for aligning the first semiconductor laser element. The second metal film is electrically connected to at least one of the electrical components, and defines a second alignment mark for aligning the first semiconductor laser element. A straight line connecting the first alignment mark and the second alignment mark extends parallel to the light emission end surface of the first semiconductor laser element.

    SEMICONDUCTOR OPTICAL DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR OPTICAL DEVICE

    公开(公告)号:US20230035065A1

    公开(公告)日:2023-02-02

    申请号:US17884875

    申请日:2022-08-10

    摘要: A semiconductor optical device includes: a base configured to intersect with a first direction; a first protrusion configured to protrude from the base in the first direction, the first protrusion including a planar lightwave circuit including: a core layer; and a cladding layer surrounding the core layer; a second protrusion configured to protrude from the base in the first direction and arranged along the first protrusion in a second direction intersecting with the first direction, a height of the second protrusion from the base in the first direction being lower than a height of the first protrusion; an optical semiconductor element placed on a facet of the second protrusion in the first direction and optically connected to the core layer; and a marker provided on the second protrusion in a manner exposed on the facet, the marker being made of a same material as the core layer.

    Light source device and external cavity laser module

    公开(公告)号:US11387623B2

    公开(公告)日:2022-07-12

    申请号:US16896448

    申请日:2020-06-09

    摘要: An external cavity laser module is configured to emit a laser beam and includes: a collimation laser light source having a Littrow configuration; a diffraction grating configured to selectively reflect and transmit light of a specific wavelength; a support member supporting the collimation laser light source and the diffraction grating; and a base rotatably supporting the support member to correct an axial direction of the laser beam emitted from the external cavity laser module.