MICROELECTROMECHANICAL SYSTEM RESONATOR ASSEMBLY

    公开(公告)号:US20230133733A1

    公开(公告)日:2023-05-04

    申请号:US17918389

    申请日:2021-03-30

    IPC分类号: H03H9/24 H03H9/02

    摘要: A silicon microelectromechanical system, MEMS, resonator assembly, includes four flexural beam elements forming a rectangular frame, each beam element being connected at an end thereof to an end of a neighboring one of the beam elements. The resonator assembly further includes connection elements for connecting the rectangular frame to at least one mechanical anchor, and the resonator assembly supporting an in-plane flexural collective resonance mode.

    TECHNIQUE FOR SPECULATIVELY GENERATING AN OUTPUT VALUE IN ANTICIPATION OF ITS USE BY DOWNSTREAM PROCESSING CIRCUITRY

    公开(公告)号:US20230133144A1

    公开(公告)日:2023-05-04

    申请号:US17518661

    申请日:2021-11-04

    申请人: Arm Limited

    IPC分类号: H03H17/02 G06F9/38

    摘要: There is provided a data processing apparatus and method. The data processing apparatus comprises a filter circuit comprising storage circuitry to store program counter values and to assert a trigger signal in response to a lookup operation using a current program counter value hitting in the storage circuitry. The processing apparatus comprises a processing unit to generate an output in response to the trigger signal. The processing apparatus is provided with resolution circuitry, associated with a downstream processing stage, to determine whether the output is of use, and in that event to assert a false miss indication in the absence of the processing unit having been triggered to produce the output. The filter circuit is configured to maintain a trigger sensitivity metric in dependence on the false miss indication, and the chosen number of bits employed when performing the lookup operation is dependent on the trigger sensitivity metric.

    Non-linear tethers for suspended devices

    公开(公告)号:US11637540B2

    公开(公告)日:2023-04-25

    申请号:US16669499

    申请日:2019-10-30

    IPC分类号: H03H9/02 H03H3/02

    摘要: A suspended device structure comprises a substrate, a cavity disposed in a surface of the substrate, and a device suspended entirely over a bottom of the cavity. The device is a piezoelectric device and is suspended at least by a tether that physically connects the device to the substrate. The tether has a non-linear centerline. A wafer can comprise a plurality of suspended device structures.