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公开(公告)号：US20230128831A1
公开(公告)日：2023-04-27
申请号：US17707713
申请日：2022-03-29
发明人： Xiulu JIN , Yunfeng JIAO , Ting WANG
摘要： A loudspeaker includes: a magnetic circuit assembly with a magnetic flux space; a vibrating diaphragm covering a first end of the magnetic flux space; and a voice coil assembly in the magnetic flux space and coupled to a side of the vibrating diaphragm facing the magnetic flux space. The voice coil assembly includes at least one group of conductive coils and a heat accumulator in thermally conductive contact with the at least one group of conductive coils, and the heat accumulator absorbs and accumulates heat when a temperature of the voice coil assembly reaches a target temperature.
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公开(公告)号：US20230127983A1
公开(公告)日：2023-04-27
申请号：US18049330
申请日：2022-10-25
发明人： Guofeng Chen , Yu Hui , Myeong Gweon Gu , Jae Hyung Lee , Jaemyoung Jhung
摘要： A piezoelectric microelectromechanical system microphone comprises a support substrate, a diaphragm including a piezoelectric material attached to the support substrate and configured to deform and generate an electrical potential responsive to impingement of sound waves on the diaphragm, and a compliant anchor formed of a material with a greater compliance than a compliance of the piezoelectric material, the compliant anchor defined in the diaphragm in an anchor region between the piezoelectric material of the diaphragm and the support substrate to improve sensitivity and reduce residual stress impact of the piezoelectric microelectromechanical system microphone.
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公开(公告)号：US20230115757A1
公开(公告)日：2023-04-13
申请号：US17905094
申请日：2020-12-05
申请人： GOERTEK INC.
发明人： Huawei LIU , Guodong ZHAO , Jie LI
摘要： The present disclosure discloses a sound generating device, which comprises: a magnetic conductive yoke; a housing extending along an edge of the magnetic conductive yoke and having an annular shape, wherein a leakage opening is formed in a gap between the housing and the magnetic conductive yoke; and a metal mesh covering the leakage opening, wherein a portion of the metal mesh corresponding to the leakage opening is provided with a plurality of air holes. The sound generating device of the present disclosure can reduce the defective rate of products.
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公开(公告)号：US20230073046A1
公开(公告)日：2023-03-09
申请号：US18048047
申请日：2022-10-20
申请人： xMEMS Labs, Inc.
发明人： Chiung C. Lo , Hao-Hsin Chang , Wen-Chien Chen , Chun-I Chang
摘要： A sound producing cell includes a membrane and an actuating layer. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other. The actuating layer is disposed on the first membrane subpart and the second membrane subpart. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.
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公开(公告)号：US11601749B1
公开(公告)日：2023-03-07
申请号：US16872557
申请日：2020-05-12
申请人： ClearOne, Inc.
IPC分类号： H04R1/40 , H04R1/08 , G10L21/0232 , H04R29/00 , H04R3/00 , H04R17/02 , H04R1/28 , H04R31/00 , H04R3/04 , G10L21/0208
摘要： This disclosure describes a ceiling tile microphone system that includes a plurality of microphones coupled together as a microphone array and used for beamforming processing, one or more separate processing devices that couple to the microphone array, where one or more separate processing devices further include beamforming, acoustic echo cancellation, and adaptive acoustic processing; a single ceiling tile with an outer surface on the front side of the ceiling tile where the outer surface is acoustically transparent, the microphone array combines with the ceiling tile as a single unit, the ceiling tile being mountable in a drop ceiling in place of a ceiling tile included in the drop ceiling; where the system is used in a drop ceiling mounting configuration; where the microphone array couples to the back side of the ceiling tile and all or part of the system is in the drop space of the drop ceiling.
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公开(公告)号：USRE49437E1
公开(公告)日：2023-02-28
申请号：US15965552
申请日：2018-04-27
申请人： Apple Inc.
发明人： Craig M. Stanley , Simon K. Porter , John H. Sheerin , Glenn K. Trainer , Jason C. Della Rosa , Ethan L. Huwe , Sean T. McIntosh , Erik L. Wang , Christopher J. Stringer , Molly J. Anderson
IPC分类号： G06F3/02 , F21V3/00 , F21V5/00 , F21V23/04 , F21V33/00 , G06F3/01 , G06F3/0354 , G06F3/041 , G06F3/16 , H01H13/02 , H03K17/96 , H04R1/02 , H04R1/26 , H04R1/28 , H04R1/30 , H04R1/40 , H04R3/00 , H04R3/12 , H04R5/02 , H04R7/12 , H04R7/18 , H04R9/02 , H04R9/06 , H04R31/00 , H05K1/02 , G06F3/044 , H05K1/14
摘要： This disclosure relates to speakers and more specifically to an array speaker for distributing music uniformly across a room. A number of audio drivers can be radially distributed within a speaker housing so that an output of the drivers is distributed evenly throughout the room. In some embodiments, the exit geometry of the audio drivers can be configured to bounce off a surface supporting the array speaker to improve the distribution of music throughout the room. The array speaker can include a number of vibration isolation elements distributed within a housing of the array speaker. The vibration isolation elements can be configured reduce the strength of forces generated by a subwoofer of the array speaker.
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公开(公告)号：US20230051272A1
公开(公告)日：2023-02-16
申请号：US17976987
申请日：2022-10-31
申请人： Bose Corporation
发明人： Csaba Guthy , David W. Beverly
IPC分类号： H04R31/00
摘要： A tool for arranging voice coil leadouts in a microspeaker comprises an expanding collet constructed and arranged for positioning at an interior of a bobbin having an inner diameter, the expanding collet including a hole that extends through an interior in a longitudinal direction of the expanding collet; a center pin extending through the hole of the expanding collet, the expanding collet applying a force against the inner diameter of the bobbin in response to a position of the center pin in the hole of the expanding collet relative to the interior of the expanding collet; and a forming mandrel including a hole that extends through an interior in a longitudinal direction of the forming mandrel. The expanding collet extends through the hole in, and coaxial with, the forming mandrel. The expanding collet rotates the bobbin about the longitudinal direction of the expanding collet relative to the forming mandrel to form helical leadout regions of a voice coil about the bobbin.
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公开(公告)号：US20230007400A1
公开(公告)日：2023-01-05
申请号：US17943801
申请日：2022-09-13
申请人： FUJIFILM Corporation
发明人： Yusuke KAGAWA , Teruo ASHIKAWA , Kazuo HIRAGUCHI
摘要： Provided is a laminated piezoelectric element capable of suppressing a short circuit between piezoelectric films in a laminated piezoelectric element in which a plurality of layers of a piezoelectric film formed by interposing a piezoelectric layer between an electrode layer and a protective layer are laminated. The laminated piezoelectric element is formed by laminating a plurality of layers of piezoelectric films each having a piezoelectric layer, two electrode layers between which the piezoelectric layer is interposed, and two protective layers respectively covering the electrode layers. At least a part of each end side of the adjacent piezoelectric films is located at a different position in a plane direction.
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公开(公告)号：US11546686B2
公开(公告)日：2023-01-03
申请号：US17301524
申请日：2021-04-06
摘要： A headphone ear pad system may generate a custom ear pad from a three-dimensional data set of a user. The custom ear pad is attach to a headphone housing and is subsequently used to form an acoustic coupling with an ear of the user and an acoustic driver of the headphone housing. The custom ear pad can have a customized cross-sectional shape and sealing surface to create an optimized acoustic profile for the user.
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公开(公告)号：US20220417634A1
公开(公告)日：2022-12-29
申请号：US17361815
申请日：2021-06-29
申请人： Audiolineout LLC
发明人： Valivann Seangly , Ben Loeliger , Kenneth Ball , Caleb Rosenau
摘要： In an embodiment, an earphone having a solid earphone body is provided. A first mounting recess is formed in a first end of the earphone body. A first acoustic driver is disposed in the first mounting recess. At least a first sound bore is formed in the solid earphone body. The at least a first sound bore fluidly communicates with the first mounting recess and a first exit port formed at a second end of the earphone body. The second end of the earphone body is configured to be placed in an ear canal of a user. The earphone can be fabricated by a method that includes defining negative spaces for the first acoustic driver and the at least a first sound bore in a virtual model of the earphone body.
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