Light irradiation type heat treatment apparatus

    公开(公告)号:US12230518B2

    公开(公告)日:2025-02-18

    申请号:US17516212

    申请日:2021-11-01

    Inventor: Nobuhiko Nishide

    Abstract: A light diffusion plate made of quartz and provided with a plurality of recessed spherical surfaces is placed on an upper chamber window so as to be in opposed relation to a central portion of a semiconductor wafer. Flashes of light emitted from flash lamps and passing by the side of the light diffusion plate impinge upon a peripheral portion of the semiconductor wafer. On the other hand, flashes of light emitted from the flash lamps and entering the light diffusion plate are diverged by the recessed spherical surfaces. Part of the light entering the light diffusion plate is diffused toward the peripheral portion of the semiconductor wafer. As a result, this increases the amount of light impinging upon the peripheral portion of the semiconductor wafer, and decreases the amount of light impinging upon the central portion of the semiconductor wafer.

    CERAMIC HEATER
    4.
    发明申请

    公开(公告)号:US20250024561A1

    公开(公告)日:2025-01-16

    申请号:US18636352

    申请日:2024-04-16

    Inventor: Shingo AMANO

    Abstract: A ceramic heater includes: a ceramic plate having a wafer placement surface on its upper surface; a plurality of zones in the wafer placement surface; a zone heater embedded in the ceramic plate for each of the plurality of zones; a single temperature detector passage in the ceramic plate; and a single temperature detector (multi TC) in the temperature detector passage. The temperature detector passage extends from the inlet in a lower surface of the ceramic plate through each of the plurality of zones. The multi TC has a plurality of temperature detecting portions. The temperature detecting portions are positioned at measurement positions corresponding to the plurality of zones.

    MICROWAVE OVEN WITH RADIANT ENERGY HEATING ELEMENT

    公开(公告)号:US20240430996A1

    公开(公告)日:2024-12-26

    申请号:US18824987

    申请日:2024-09-05

    Abstract: A heating arrangement for a cooking appliance, such as a toaster or oven. Heating elements can be exposed in a cavity of the appliance and can have a shield that permits infrared energy to pass but blocks microwaves and/or provides physical support for internal components such as a quartz tube or resistance element. The shield can be grounded to one or more cavity walls by grounding elements that engage with the shield and a portion of the cavity wall. The heating element can emit a greater amount of infrared radiation in one direction than an opposite direction, e.g., due to a convex or other shape of the resistance element. Sets of heating elements can be controlled so that a second element begins to emit visible light at a same time that a first element stops emitting visible light. Convection air can be directed at one or more heating elements, which diffuse the air flow or otherwise prevent flow of air directly to food in the cavity.

    Power control device, fixing device, and image forming apparatus

    公开(公告)号:US12169379B2

    公开(公告)日:2024-12-17

    申请号:US18163831

    申请日:2023-02-02

    Abstract: A power control device includes a heater, a zero-cross detecting unit, a triac, a supplying unit, and a controlling unit. The supplying unit discharges an electric charge when a control signal is outputted in a half-wave of each of a first polarity and a second polarity and charges the electric charge when the control signal is not outputted in the half-wave of the first polarity. The controlling unit outputs: in a first half-wave, a first control signal on the basis of the zero-cross point and a second control signal in a first phase different in timing from the first control signal, and in a second half-wave, a third control signal on the basis of the zero-cross point and a fourth control signal in a second phase different in timing from the second control signal. The first phase and the second phase are different from each other.

    THERMAL SYSTEM WITH A TEMPERATURE LIMITING DEVICE

    公开(公告)号:US20240381493A1

    公开(公告)日:2024-11-14

    申请号:US18779862

    申请日:2024-07-22

    Abstract: A thermal system includes a two-wire heater and a power switch. The power switch is to provide power to the two-wire heater from a power source based on a control signal. The thermal system includes a controller having a sensor circuit configured to measure an electrical characteristic of the two-wire heater. The controller is to calculate a temperature of the thermal system based on a change in the measured electrical characteristic and determine whether the temperature is greater than a temperature setpoint. The controller is to output the control signal based on the determination.

    Heating platform, thermal treatment and manufacturing method

    公开(公告)号:US12142497B2

    公开(公告)日:2024-11-12

    申请号:US17363033

    申请日:2021-06-30

    Abstract: A heating platform for heating a wafer is provided. The heating platform includes a support carrier, a detection module and a first heating module. The wafer is supported by the support carrier. The detection module is configured to monitor a surface condition of the wafer supported by the support carrier. The first heating module is disposed at a side of the support carrier. The first heating module includes a plurality of heating units electrically connected to the detection module, and the heating units is arranged in an array. A thermal treatment and a manufacturing method are further provided.

    Image forming apparatus
    10.
    发明授权

    公开(公告)号:US12135515B2

    公开(公告)日:2024-11-05

    申请号:US18358142

    申请日:2023-07-25

    Abstract: Provided is an image forming apparatus including a temperature sensing circuit to which a temperature sensing element is electrically connected, wherein a surface of a heater on a side where the temperature sensing element is provided is in contact with the inner surface of a film, a heating element is provided in a primary side circuit which is electrically connected to a commercial power supply, and the temperature sensing circuit is electrically insulated from both of the primary side circuit and a secondary side circuit which is electrically insulated from the primary side circuit.

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