公开(公告)号：US12127339B2

公开(公告)日：2024-10-22

申请号：US17968119

申请日：2022-10-18

申请人： Murata Manufacturing Co., Ltd.

发明人： Tadahiko Matsumoto

IPC分类号： H05K1/00 ,  H01R12/52 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC分类号： H05K1/0283 ,  H01R12/52 ,  H05K1/0306 ,  H05K1/181

摘要： A stretchable mounting substrate that includes a first substrate including a stretchable base material and a stretchable wiring on the stretchable base material; a second substrate including a wiring for an electronic component, the second substrate overlapping at least a part of the first substrate in a plan view of the stretchable mounting substrate; and a connection member connecting the first substrate and the second substrate, the connection member including a connection base material and a connection wiring connecting the stretchable wiring of the first substrate and the wiring of the second substrate 20, wherein the connection member is configured to be deformed in accordance with an expansion/contraction direction of the first substrate so that an expansion/contraction ratio of a region of the first substrate overlapping the second substrate in the plan view is larger than an expansion/contraction ratio of the second substrate.

公开(公告)号：US12108520B2

公开(公告)日：2024-10-01

申请号：US17811947

申请日：2022-07-12

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Kazuhiro Yoshida

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/18

CPC分类号： H05K1/0216 ,  H05K1/181 ,  H05K1/184 ,  H05K1/189

摘要： A circuit board includes a magnetic shielding member having a first principal surface, and a second principal surface on an opposite side from the first principal surface, and a flexible wiring board having a first surface, and a second surface on an opposite side from the first surface. The second surface of the flexible wiring board is fixed to the first principal surface and the second principal surface of the magnetic shielding member. The first surface of the flexible wiring board includes a circuit area mounted with an electronic component, and one or more terminal areas where connection terminals are disposed. The circuit area is disposed above the first principal surface of the magnetic shielding member. The circuit board has a bent shape bent along the magnetic shielding member, so that the one or more terminal areas are disposed below the second principal surface of the magnetic shielding member.

公开(公告)号：US12078301B2

公开(公告)日：2024-09-03

申请号：US18244603

申请日：2023-09-11

申请人： JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO., LTD

发明人： Aiming Xiong ,  Xintong Liu ,  Junren Chen ,  Hechen Hu ,  Hao Zhang

IPC分类号： F21K9/278 ,  F21K9/272 ,  F21K9/275 ,  F21V3/06 ,  F21V15/015 ,  F21V23/00 ,  F21V23/02 ,  F21V25/02 ,  F21V25/04 ,  F21V29/70 ,  H05B45/00 ,  H05B45/10 ,  H05B45/20 ,  H05B45/37 ,  H05B45/50 ,  H05B45/59 ,  H05K1/00 ,  F21V29/83 ,  F21Y103/10 ,  F21Y115/10 ,  H05K1/14

CPC分类号： F21K9/278 ,  F21K9/272 ,  F21K9/275 ,  F21V3/061 ,  F21V15/015 ,  F21V23/003 ,  F21V23/005 ,  F21V23/023 ,  F21V25/02 ,  F21V25/04 ,  F21V29/70 ,  H05B45/00 ,  H05B45/10 ,  H05B45/20 ,  H05B45/37 ,  H05B45/50 ,  H05B45/59 ,  H05K1/00 ,  F21V23/02 ,  F21V29/83 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/147 ,  H05K2201/10106 ,  Y02B20/30

摘要： An LED lamp and a power supply module thereof are provided. The power supply module includes a driving circuit, a OVP circuit, and an impedance detection circuit. The OVP circuit is configured to determine whether an OVP condition is detected by sampling the driving signal, and the impedance detection circuit is configured to determine whether a user touching state is detected. When either the OVP condition or the user touching state is detected, the power switch of the driving circuit will be controlled to limit the amount of a current flowing through the power switch. In addition, the impedance detection circuit could detect the user touching state by comparing signals with a defined level sampled during each pulse, thus enhancing the detection accuracy.

公开(公告)号：US12069800B2

公开(公告)日：2024-08-20

申请号：US17469489

申请日：2021-09-08

申请人： Rohde & Schwarz GmbH & Co. KG

发明人： Andreas Ziegler ,  Stefan Ketzer

IPC分类号： H05K1/00 ,  G01R19/10 ,  H05K1/02 ,  H05K3/00

CPC分类号： H05K1/0271 ,  G01R19/10 ,  H05K1/0254 ,  H05K3/0044 ,  H05K2201/09063

摘要： The present disclosure provides a circuit board arrangement comprising a main board comprising at least one longitudinal cutout, at least one reinforcing plate arranged in the at least one longitudinal cutout and mechanically coupled to the main board, wherein the plane of main extension of the main board is arranged perpendicular to the plane of main extension of the at least one reinforcing plate. Further, the present disclosure provides a differential probe circuit and a respective method.

公开(公告)号：US12063735B2

公开(公告)日：2024-08-13

申请号：US18353295

申请日：2023-07-17

申请人： Texas Instruments Incorporated

发明人： Snehamay Sinha ,  Tapobrata Bandyopadhyay ,  Markarand Ramkrishna Kulkarni

IPC分类号： H05K1/00 ,  H01L21/02 ,  H01L23/06 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC分类号： H05K1/0221 ,  H01L21/02008 ,  H01L23/06 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/115 ,  H05K3/42

摘要： An electronic substrate includes a dielectric core, a first conducting layer on a first side of the core and a second conducting layer on the second side of the core opposite the first side. At least one differential coaxial through-via includes a first inner signal through-via that is at least electrical conductor lined for a first signal path and at least a second inner signal through-via that is also at least electrical conductor lined positioned side-by-side and being dielectrically isolated from the first inner signal through-via for a second signal path. An annular-shaped outer ground shield enclosure is at least conductor lined that surrounds and is dielectrically isolated from both the first and second inner signal through-vias.

公开(公告)号：US12035482B2

公开(公告)日：2024-07-09

申请号：US17650096

申请日：2022-02-07

申请人： Eagle Technology, LLC

发明人： John Voelkel

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K3/26 ,  H05K3/30 ,  H05K3/34 ,  H05K3/42

CPC分类号： H05K3/306

摘要： An electronic device may include a connector having a connector body and conductive pins extending outwardly from the connector body, and a circuit board having a dielectric layer, and spaced apart female contacts extending therein. Each female contact may include a conductive tubular via, a core within the conductive tubular via, and a conductive cup having a lower end abutting and joined to the conductive tubular via and an upper end defining a recess receiving a corresponding conductive pin of the connector. The conductive cup may have an outer diameter greater than an outer diameter of the conductive tubular via.

公开(公告)号：US12022614B2

公开(公告)日：2024-06-25

申请号：US17487673

申请日：2021-09-28

申请人： Samsung Electronics Co., Ltd.

发明人： Bongkyu Min ,  Taewoo Kim ,  Jinyong Park ,  Hyelim Yun ,  Hyeongju Lee ,  Sanghoon Park ,  Jiseon Han

IPC分类号： H05K1/00 ,  H01L23/528 ,  H04M1/02 ,  H05K1/11 ,  H05K1/14

CPC分类号： H05K1/141 ,  H01L23/528 ,  H04M1/0277 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K2201/10378

摘要： The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.

公开(公告)号：US20240090140A1

公开(公告)日：2024-03-14

申请号：US18517650

申请日：2023-11-22

申请人： FUJIKURA LTD.

发明人： Masahiro Okamoto

IPC分类号： H05K3/46 ,  H01L23/12 ,  H05K1/00 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/10

CPC分类号： H05K3/46 ,  H01L23/12 ,  H05K1/00 ,  H05K1/03 ,  H05K1/112 ,  H05K1/183 ,  H05K3/0008 ,  H05K3/103 ,  H05K1/0251

摘要： A component-incorporated substrate of multi-layer structure includes: a first printed wiring base having an opening; a second printed wiring base in a first side of the first printed wiring base; a third printed wiring base in a second side of the first printed wiring base; an electronic component housed in the opening of the first printed wiring base; a via penetrating one or more of the first printed wiring base, the second printed wiring base and the third printed wiring base; and an adhesive layer that fills a gap between the electronic component and the opening, a gap between the first printed wiring base and the second printed wiring base, and a gap between the first printed wiring base and the third printed wiring base.

公开(公告)号：US11860460B2

公开(公告)日：2024-01-02

申请号：US17741175

申请日：2022-05-10

申请人： Aristocrat Technologies Australia Pty Limited

发明人： Timothy Seckel

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H01H13/83 ,  H01H13/86 ,  H01H13/7057 ,  G02F1/1333 ,  G02F1/1345 ,  H05K3/36 ,  H01H9/18 ,  G07F17/32

CPC分类号： G02F1/133308 ,  G02F1/13452 ,  G07F17/3209 ,  G07F17/3211 ,  G07F17/3216 ,  H01H9/181 ,  H05K3/361 ,  G02F1/13332 ,  G02F2201/46

摘要： A button deck assembly includes a button deck having at least one mechanical pushbutton, the pushbutton includes a lens cap, a liquid-crystal display (LCD) panel, and an optical block configured to transmit images from the LCD panel for display through the lens cap, a bottom surface of the optical block is positioned on the LCD panel, an air gap is defined between a top surface of the optical block and the lens cap. The assembly also includes a printed circuit board (PCB) assembly defining a PCB aperture, the PCB aperture is sized to receive the optical block, and an elastomeric membrane defining a membrane aperture sized to receive the optical block, the optical block extends from the LCD panel through the PCB and membrane apertures, the membrane channels fluid flow to outer edges of the membrane and around the PCB assembly and the LCD panel.

公开(公告)号：US11839033B2

公开(公告)日：2023-12-05

申请号：US17728234

申请日：2022-04-25

申请人： Korea University Research and Business Foundation

发明人： Soong Ju Oh ,  Jun Sung Bang

IPC分类号： H05K1/00 ,  H05K1/02 ,  H05K3/06 ,  H03K19/21 ,  A61K8/06 ,  A61K8/26 ,  A61K8/89 ,  A61K8/92 ,  A61K8/891 ,  A61K8/895 ,  A61Q1/04 ,  A61Q1/06 ,  H05K3/38 ,  H05K1/09

CPC分类号： H05K3/389 ,  H05K1/0283 ,  H05K3/064 ,  H05K3/381 ,  H05K1/092

摘要： Disclosed are a method of directly patterning a stretchable substrate; and a stretchable electrode fabricated by the method. More particularly, the method of directly patterning a stretchable substrate includes: forming a hydrophilic group on a surface of a stretchable substrate by UV-ozone treatment; forming at least one layer to be etched on the hydrophilic group-formed stretchable substrate, wherein the at least one layer to be etched includes an adhesion enhancing material; forming a photoresist layer on the at least one layer to be etched; exposing the photoresist layer; and patterning the at least one layer to be etched using the exposed photoresist layer, wherein a carbon chain included in the adhesion enhancing material forms ether bonding (R—O—R) with a hydrophilic group formed on the surface of the stretchable substrate.