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公开(公告)号：US20230139231A1
公开(公告)日：2023-05-04
申请号：US18091133
申请日：2022-12-29
申请人： Hong Heng Sheng Electronical Technology (HuaiAn)Co.,Ltd. , Avary Holding (Shenzhen) Co., Limited.
发明人： PAN TANG , FU-LIN CHANG
摘要： A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.
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公开(公告)号：US11641716B2
公开(公告)日：2023-05-02
申请号：US16474705
申请日：2017-12-04
发明人： Kou Noguchi , Hiroshi Ueda
摘要： A method for manufacturing a printed circuit board according to one embodiment of the present invention includes a step of forming a resist pattern, and a step of forming a conductive pattern by using the resist pattern. The resist pattern has an acute angle portion in which an outer edge of a resist is bent to form an acute angle in a plan view. In a corner portion of the acute angle portion, an outer-side outer edge of the resist is rounded, and a radius of curvature of the outer-side outer edge is more than or equal to a distance from the outer-side outer edge to another outer edge adjacent thereto in a direction away from a center of curvature of the outer-side outer edge.
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3.发明授权公开(公告)号：US11641072B2
公开(公告)日：2023-05-02
申请号：US17327297
申请日：2021-05-21
发明人： Weijian Pan , Zhixiang Hu , Dan Yang
摘要： This application relates to the field of power supply packaging technologies, and in particular, to a PCB-pinout based packaged module, including a packaged module and a pin exposed outside the packaged module. The packaged module includes a PCB and a power component. The PCB has a first surface and a second surface that are disposed opposite to each other, and the power component is disposed on the first surface or the second surface of the PCB. The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB. The pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.
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公开(公告)号：US20230119865A1
公开(公告)日：2023-04-20
申请号：US18068785
申请日：2022-12-20
摘要： The disclosure relates to a machining station for machining platelike workpieces (1) by means of at least one tool (10, 13, 14). The machining station has a measuring device (16) for acquiring data relating to the position of bores, a drill (10, 13, 14) for generating bores in the workpiece (1), and a data processor (17) for processing data of the at least one measuring device (16) and/or for controlling the at least one drill (10, 13, 14). The data processor (17) is here suitable and set up for performing an adjustment between a desired drilling position and/or a desired bore depth and an actual position and/or actual depth as determined by the at least one measuring device (16) for a bore present in the workpiece (1), and adapting the drilling position and/or bore depth for generating bores by means of the at least one drill (10, 13, 14).
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公开(公告)号：US20230119513A1
公开(公告)日：2023-04-20
申请号：US17972161
申请日：2022-10-24
申请人： NuCurrent, Inc.
发明人： Oleg Los
摘要： A PCB for wireless power transfer includes an antenna and the antenna includes a coil. A method for manufacturing the PCB includes providing a prefabricated PCB, the prefabricated PCB including a PCB design and a first area and providing a first sheet of a conductive metal for the first area. The method includes applying an etch resistant coating on a coil area within the first area and laser cutting the first sheet within the coil area, based on a laser cutting path for a first plurality of turns for a first layer of the coil, the first geometry configured wireless power transfer. The method further includes substantially exposing the first sheet to an etching solution, the etching solution substantially removing first portions of the conductive metal from the substrate to define, at least, first turn gaps between at least two of the first plurality of turns.
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公开(公告)号：US20230118070A1
公开(公告)日：2023-04-20
申请号：US17933628
申请日：2022-09-20
发明人： Hongyu YU , Ruoqin WANG
摘要： A kirigami enabled manufacturing method and systems are provided. The method includes providing a plurality of substrate units for mounting electronic devices in an initial state; providing at least one connector connecting adjacent substrate units of the plurality of substrate units in the initial state, wherein the at least one connector includes one or more foldable areas defined by a plurality of creases and n stretchable layers stacking on one another; folding the one or more foldable areas of the connector along the plurality of creases by 180°; and flipping and expanding the n stretchable layers of the connector into one layer of a planar predetermined pattern connecting the plurality of substrate units. The enabled manufacturing method and systems expand a small area of thin film material to a large area network by the folding and expanding processes.
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公开(公告)号：US11627664B2
公开(公告)日：2023-04-11
申请号：US16425809
申请日：2019-05-29
摘要： A method for manufacturing a flexible circuit electrode array, comprising: a) depositing a metal trace layer containing a base coating layer, a conducting layer and a top coating layer on the insulator polymer base layer; b) applying a layer of photoresist on the metal trace layer and patterning the metal trace layer and forming metal traces on the insulator polymer base layer; c) activating the insulator polymer base layer and depositing a top insulator polymer layer and forming one single insulating polymer layer with the base insulator polymer layer; d) applying a thin metal layer and a layer of photoresist on the surface of the insulator polymer layer and selective etching the insulator layer and the top coating layer to obtain at least one via; and e) filling the via with electrode material. A layer of polymer is laid down. A layer of metal is applied to the polymer and patterned to create electrodes and leads for those electrodes. A second layer of polymer is applied over the metal layer and patterned to leave openings for the electrodes, or openings are created later by means such as laser ablation. Hence the array and its supply cable are formed of a single body. Alternatively, multiple alternating layers of metal and polymer may be applied to obtain more metal traces within a given width.
The method provides an excellent adhesion between the polymer base layer and the polymer top layer and insulation of the trace metals and electrodes.-
公开(公告)号：US11617263B2
公开(公告)日：2023-03-28
申请号：US17335059
申请日：2021-05-31
申请人： Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , GARUDA TECHNOLOGY CO., LTD.
发明人： Lin-Jie Gao , Yong-Chao Wei
IPC分类号： H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H05K1/18 , H05K3/06 , H05K3/30 , H05K3/42 , H05K3/46 , H01L21/768 , H01L23/48 , H01L23/498 , G02B6/10 , H05K3/00 , H05K1/05 , H05K3/34
摘要： A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.
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公开(公告)号：US20230082429A1
公开(公告)日：2023-03-16
申请号：US17939786
申请日：2022-09-07
发明人： Niels Kirkeby , Michael Len
摘要： A method is provided for forming waveguides in a PCB. The method may include forming an opening in a PCB core comprising a plurality of conductive layers interleaved with a plurality of insulating layers, the opening extending from a first side of the PCB core to a second side of the PCB core. The method may also include filling the opening with metal. The method may also include forming a cavity enclosed by sidewalls by removing a first portion of the filled opening, the cavity extending from the first side of the PCB core to the second side of the PCB core. A second portion of the filled opening is a heat transfer element configured to transfer heat from the first side of the PCB core to the second side of the PCB core. The at least one waveguide is embedded within the heat transfer element and configured for transmitting signals from the first side to the second side.
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公开(公告)号：US20230073563A1
公开(公告)日：2023-03-09
申请号：US17900406
申请日：2022-08-31
发明人： Hayato TAKAKURA , Yasunari OYABU , Naoki SHIBATA
摘要： Provided is a method for producing a wired circuit board in which a first preparation step of preparing a first substrate having an insulating layer and a conductive layer disposed on one surface of the insulating layer; a second preparation step of preparing a second substrate having a metal layer; a bonding step of laminating the first substrate and the second substrate so that the conductive layer and the metal layer are in contact with each other, and metal-bonding the conductive layer and the metal layer; and a patterning step of forming a conductive pattern on the other surface of the insulating layer are carried out.
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