CHARACTERIZING AND MEASURING IN SMALL BOXES USING XPS WITH MULTIPLE MEASUREMENTS

    公开(公告)号:WO2023067580A1

    公开(公告)日:2023-04-27

    申请号:PCT/IB2022/060178

    申请日:2022-10-24

    Abstract: A system to characterize a film layer within a measurement box is disclosed. The system obtains a first mixing fraction corresponding to a first X-ray beam, the mixing fraction represents a fraction of the first X-ray beam inside a measurement box of a wafer sample, the measurement box represents a bore structure disposed over a substrate and having a film layer disposed inside the bore structure. The system obtains a contribution value for the measurement box corresponding to the first X-ray beam, the contribution value representing a species signal outside the measurement box that contributes to a same species signal inside the measurement box. The system obtains a first measurement detection signal corresponding to a measurement of the measurement box using the first X-ray beam. The system determines a measurement value of the film layer based on the first measurement detection signal, the contribution value, and the first mixing fraction.

Patent Agency Ranking