Abstract:
A photonic integrated circuit (100) is presented that includes a substrate (102), and a first (204) and second waveguide (206) patterned on the substrate (102). The first waveguide (204) guides an input beam of radiation. The photonic integrated circuit also includes a coupling region (208), wherein the first and second waveguides (204, 206) each pass through the coupling region (208). One or more modulating elements (210) are coupled to each of the first and second waveguides (204, 206). The first waveguide (204) and the second waveguide (206) have a first facet (212a) and a second facet (212b), respectively, and first and second reflections are generated at the first and second facets (212a, 212b) within the first and second waveguides (204, 206), respectively. The one or more modulating elements (210) coupled to each of the first and second waveguides (204, 206) are designed to adjust the phase of the first and second reflections before the first and second reflections pass through the coupling region (208).
Abstract:
Optical waveguide coupling ratios can be modified for a package by providing a substrate (104) with a photonic circuit (108) disposed on a first section (103) of the substrate (104) and a plurality of optical waveguides (100) formed in glass (110) disposed on a second section (105) of the substrate (104), the waveguides (100) being connected to the photonic circuit (108), adjacent ones of the waveguides (100) having a fixed coupling ratio. A three-dimensional region of the glass (110) abutting an end of one or more of the waveguides (100) is lased (112) to change a refractive index of the glass (110) in each three-dimensional region, and thereby extend a length of each waveguide (100) abutting one of the three-dimensional regions so that the coupling ratio between that waveguide (100) and an adjacent waveguide (100) is changed as a function of the extended length. The lasing (112) is controlled based on feedback (118) so that each coupling ratio changed by the lasing (112) varies by less than a target amount.
Abstract:
A hybrid integrated module (100) includes a semiconductor die (110) mechanically coupled face-to-face to an integrated device (116) in which substrate has been removed. For example, the integrated circuit includes an optical waveguide (136) that conveys an optical signal, which is fabricated on a silicon-on-insulator (SOI) wafer in which the back-side silicon substrate or handler has been completely removed. An optical device (134) is disposed on the bottom surface (130) of an oxide layer (126) (such as a buried-oxide layer) in the integrated device, and the geometry and materials in the integrated device (116) are selected and/or defined so that the optical signal is evanescently coupled between the optical waveguide (136) and the optical device (134).
Abstract:
An optical apparatus comprises: source, primary, and secondary waveguides formed in waveguide layers on a substrate; a light source; and an optical waveguide tap. The light source launches a source optical signal along the source waveguide. The tap divides the source optical signal into a primary optical signal in the primary waveguide and a secondary optical signal in the secondary waveguide. The secondary optical signal emerges from the secondary waveguide to exit the waveguide layers at the substrate edge or to propagate within the waveguide layers as a stray optical signal without confinement by any waveguide. The stray optical signal propagates thusly unconfined into the open mouth of an optical trap that comprises one or more lateral surfaces formed in the waveguide layers and an opaque coating on the lateral surfaces, and comprises a spiral region of the optical waveguide layers with an open mouth and closed end.