中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

49 records (took 0.046 seconds)

筛选除外

    METHOD AND APPARATUS FOR FORMING ADVANCED POLISHING PADS USING AN ADDITIVE MANUFACTURING PROCESS
    21.
    发明申请
    METHOD AND APPARATUS FOR FORMING ADVANCED POLISHING PADS USING AN ADDITIVE MANUFACTURING PROCESS 审中-公开
    使用添加剂制造工艺形成先进抛光垫的方法和设备

    公开(公告)号：WO2017066077A1

    公开(公告)日：2017-04-20

    申请号：PCT/US2016/055793

    申请日：2016-10-06

    Applicant: APPLIED MATERIALS, INC.

    Inventor： GANAPATHIAPPAN, Sivapackia ,  FU, Boyi ,  CHOCKALINGAM, Ashwin ,  REDFIELD, Daniel ,  BAJAJ, Rajeev ,  ORILALL, Mahendra C. ,  NG, Hou T. ,  FUNG, Jason G. ,  YAMAMURA, Mayu

    IPC: B24D11/00 ,  B24D3/28 ,  B24B37/24 ,  B33Y10/00 ,  B24B37/26 ,  B24D11/04 ,  B24B37/22 ,  B33Y80/00 ,  B24D18/00

    CPC classification number: B24B37/22 ,  B24B37/24 ,  B33Y10/00 ,  B33Y80/00

    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

    Abstract translation: 本公开的实施例涉及具有可调化学，材料和结构特性的高级抛光垫以及制造该抛光垫的新方法。 根据本公开的一个或多个实施例，已经发现具有改进性能的抛光垫可以通过诸如三维（3D）印刷工艺的增材制造工艺来生产。 本发明的实施例因此可以提供具有离散特征和几何形状的高级抛光垫，其由包括功能聚合物，官能低聚物，反应性稀释剂，加成聚合物前体化合物，催化剂和固化剂的至少两种不同材料形成。 例如，高级抛光垫可以由多个聚合物层形成，通过自动顺序沉积至少一种聚合物前体组合物，随后进行至少一个固化步骤，其中每个层可以代表至少一种聚合物组合物和/ 或不同成分的区域。 本公开的实施方式进一步提供了具有聚合物层的抛光垫，所述聚合物层可以是互穿聚合物网络。

    UV CURABLE CMP POLISHING PAD AND METHOD OF MANUFACTURE
    22.
    发明申请
    UV CURABLE CMP POLISHING PAD AND METHOD OF MANUFACTURE 审中-公开
    UV可固化CMP抛光垫及其制造方法

    公开(公告)号：WO2016099791A1

    公开(公告)日：2016-06-23

    申请号：PCT/US2015/061647

    申请日：2015-11-19

    Applicant: APPLIED MATERIALS, INC.

    Inventor： ORILALL, Mahendra Christopher ,  BAJAJ, Rajeev ,  REDEKER, Fred C.

    IPC: H01L21/304

    CPC classification number: B24D11/001 ,  B24D3/32 ,  B24D11/00 ,  B29C35/0805 ,  B29C35/0888 ,  B29C2035/0822 ,  B29C2035/0827

    Abstract: A method of fabricating a chemical mechanical polishing pad includes introducing polymer precursors containing acrylate functional groups into a mold, providing abrasive particles and a photo-initiator in the polymer precursors to form a mixture, and while the mixture is contained between a bottom plate and a top cover of the mold, exposing the mixture to ultraviolet radiation through a transparent section of the mold to cause the polymer precursors to form radicals, forming a polymer matrix from the polymer precursor by causing the radicals to cross-link with one another. The polishing layer includes the polymer matrix having the abrasive particles dispersed therein.

    Abstract translation: 制造化学机械抛光垫的方法包括将含有丙烯酸酯官能团的聚合物前体引入模具中，在聚合物前体中提供磨料颗粒和光引发剂以形成混合物，并且当混合物包含在底板和 模具的顶盖，通过模具的透明部分将混合物暴露于紫外线辐射，以使聚合物前体形成自由基，通过使自由基彼此交联从聚合物前体形成聚合物基质。 抛光层包括其中分散有磨料颗粒的聚合物基质。

    CHEMICAL MECHANICAL POLISHING APPARATUS AND METHODS
    23.
    发明申请
    CHEMICAL MECHANICAL POLISHING APPARATUS AND METHODS 审中-公开
    化学机械抛光装置及方法

    公开(公告)号：WO2016014870A1

    公开(公告)日：2016-01-28

    申请号：PCT/US2015/041856

    申请日：2015-07-23

    Applicant: APPLIED MATERIALS, INC

    Inventor： OSTERHELD, Thomas H. ,  BAJAJ, Rajeev

    IPC: H01L21/304

    CPC classification number: H01L21/30625 ,  B24B37/042 ,  B24B37/10 ,  B24B57/02 ,  H01L21/31055 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092

    Abstract: Embodiments of the invention provide a non-uniform substrate polishing apparatus that includes a polishing pad with two or more zones, each zone adapted to apply a different slurry chemistry to a different area on a substrate to create a film thickness profile on the substrate having at least two different film thicknesses. Polishing methods and systems adapted to polish substrates are also provided, as are numerous other aspects.

    Abstract translation: 本发明的实施例提供了一种不均匀的衬底抛光装置，其包括具有两个或更多个区域的抛光垫，每个区域适于将不同的浆料化学品施加到衬底上的不同区域上，以在衬底上形成膜厚分布， 最少两个不同的膜厚度。 还提供了适于抛光底物的抛光方法和系统，以及许多其它方面。

    POLISHING PADS HAVING IMPROVED PORE STRUCTURE
    25.
    发明申请
    POLISHING PADS HAVING IMPROVED PORE STRUCTURE 审中-公开

    公开(公告)号：WO2022245404A1

    公开(公告)日：2022-11-24

    申请号：PCT/US2022/013292

    申请日：2022-01-21

    Applicant: APPLIED MATERIALS, INC.

    Inventor： GANAPATHIAPPAN, Sivapackia ,  SRIDHAR, Uma ,  LUO, Yingdong ,  CHOCKALINGAM, Ashwin ,  YAMAMURA, Mayu ,  ROZO, Sebastian David ,  REDFIELD, Daniel ,  BAJAJ, Rajeev ,  PATIBANDLA, Nag B. ,  NG, Hou T. ,  MADHUSOODHANAN, Sudhakar

    IPC: B24D11/00 ,  B24B37/24

    Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore- features formed therein. The pre-polymer composition includes a multifunctional acrylate component. A curing rate of the dispensed droplets of the pre-polymer composition including the multifunctional acrylate component when exposed to a first dose of electromagnetic radiation is greater than a curing rate of the pre-polymer composition without the multifunctional acrylate component when exposed to the same first dose of electromagnetic radiation.

    ABRASIVE DELIVERY POLISHING PADS AND MANUFACTURING METHODS THEREOF
    30.
    发明申请
    ABRASIVE DELIVERY POLISHING PADS AND MANUFACTURING METHODS THEREOF 审中-公开

    公开(公告)号：WO2019032286A1

    公开(公告)日：2019-02-14

    申请号：PCT/US2018/043527

    申请日：2018-07-24

    Applicant: APPLIED MATERIALS, INC.

    Inventor： CHOCKALINGAM, Ashwin ,  BAJAJ, Rajeev ,  KUMAR, Ashavani ,  REDFIELD, Daniel

    IPC: H01L21/304 ,  H01L21/3105 ,  H01L21/321 ,  H01L21/67

    CPC classification number: B24B37/26 ,  B24B37/245 ,  B24D3/346 ,  B24D11/04 ,  B24D2203/00

    Abstract: Embodiments of the present disclosure provide for abrasive delivery (AD) polishing pads and manufacturing methods thereof. In one embodiment, a method of forming a polishing article includes forming a sub-polishing element from a first curable resin precursor composition and forming a plurality of polishing elements extending from the sub-polishing element. Forming the plurality of polishing elements includes forming a continuous polymer phase from a second curable resin precursor composition and forming a plurality of discontinuous abrasive delivery features disposed within the continuous polymer phase. The sub-polishing element is formed by dispensing a first plurality of droplets of the first curable resin precursor composition. The plurality polishing elements are formed by dispensing a second plurality of droplets of the second curable resin precursor composition. In some embodiments, the discontinuous abrasive delivery features comprise a water soluble material having abrasive particles interspersed therein.

Patent Agency Ranking