-
公开(公告)号：WO2018231212A1
公开(公告)日：2018-12-20
申请号：PCT/US2017/037378
申请日：2017-06-14
Applicant: INTEL CORPORATION
Inventor： LIFF, Shawna , ELSHERBINI, Adel A. , SWAN, Johanna M. , FALCON, Javier A. , NAM, Ye Seul , CLARKE, James S. , ROBERTS, Jeanette M. , CAUDILLO, Roman
Abstract: Disclosed herein are quantum computing (QC) package structures, as well as related methods and devices. In some embodiments, a QC package may include: a package substrate; a quantum processing die coupled to the package substrate; and a lid above the quantum processing die such that the quantum processing die is between the package substrate and a top portion of the lid, wherein the lid is electrically coupled to the quantum processing die and to the package substrate. In some embodiments, a QC package may include: a package substrate; and a quantum processing die coupled to the package substrate; wherein the quantum processing die includes at least one first stop element, the package substrate includes at least one second stop element, and the first stop elements are aligned with the second stop elements to provide a mechanical stop structure between the quantum processing die and the package substrate
-
公开(公告)号：WO2018063682A1
公开(公告)日：2018-04-05
申请号：PCT/US2017/049215
申请日：2017-08-29
Applicant: INTEL CORPORATION
Inventor： LIFF, Shawna M. , ELSHERBINI, Adel A. , OSTER, Sasha N. , EID, Feras , DOGIAMIS, Georgios C. , SOUNART, Thomas L. , SWAN, Johanna M.
IPC: H01L41/18 , H01L41/09 , H01L41/083 , H01L41/12
Abstract: Embodiments of the invention include a reconfigurable communication system, that includes a substrate and a metamaterial shield formed over the substrate. In an embodiment, the metamaterial shield surrounds one or more components on the substrate. Additionally, a plurality of first piezoelectric actuators may be formed on the substrate. The first piezoelectric actuators may be configured to deform the metamaterial shield and change a frequency band that is permitted to pass through the metamaterial shield. Embodiments may also include a reconfigurable antenna that includes a metamaterial. In an embodiment, a plurality of second piezoelectric actuators may be configured to deform the metamaterial of the antenna and change a central operating frequency of the antenna. Embodiments may also include an integrated circuit electrically coupled to the plurality of first piezoelectric actuators and second piezoelectric actuators.
Abstract translation: 本发明的实施例包括可重新配置的通信系统，该可重新配置的通信系统包括衬底和形成在衬底上的超材料屏蔽。 在一个实施例中，超材料屏蔽包围衬底上的一个或多个部件。 另外，可以在基板上形成多个第一压电致动器。 第一压电致动器可以被配置成使超材料屏蔽件变形并且改变被允许穿过超材料屏蔽件的频带。 实施例还可以包括包含超材料的可重新配置的天线。 在一个实施例中，多个第二压电致动器可以被配置成使天线的超材料变形并且改变天线的中央操作频率。 实施例还可以包括电耦合到多个第一压电致动器和第二压电致动器的集成电路。
-
公开(公告)号：WO2018063627A1
公开(公告)日：2018-04-05
申请号：PCT/US2017/048755
申请日：2017-08-25
Applicant: INTEL CORPORATION
Inventor： ELSHERBINI, Adel A. , OSTER, Sasha N , SWAN, Johanna M. , DOGIAMIS, Georgios C. , LIFF, Shawna M. , ALEKSOV, Aleksandar , KAMGAING, Telesphor
Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide connector. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a planar first member and a planar second member that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide connector.
Abstract translation: 这里描述的系统和方法提供了一种行波发射器系统，其物理地且可通信地耦合到半导体封装和波导连接器。 行波发射器系统包括一个槽线信号转换器和一个锥形槽发射器。 槽线信号转换器可以与半导体封装整体形成并且包括将微带信号转换为槽线信号的平衡 - 不平衡转换器结构。 锥形槽发射器可通信地耦合到槽线信号转换器并且包括形成槽的平面第一构件和平面第二构件。 锥形槽发射器将槽线信号转换成传播到波导连接器的行波信号。
-
公开(公告)号：WO2018017206A1
公开(公告)日：2018-01-25
申请号：PCT/US2017/037301
申请日：2017-06-13
Applicant: INTEL CORPORATION
Inventor： EID, Feras , OSTER, Sasha N. , ELSHERBINI, Adel A. , ALEKSOV, Aleksandar , SWAN, Johanna M. , BAXI, Amit Sudhir , MAGESHKUMAR, Vincent S.
CPC classification number: H01R13/6205 , H01R11/30 , H01R13/627 , H01R13/631
Abstract: Discussed generally herein are methods and devices including or providing a magnetic, detachable, conductive connector to provide an electrical and mechanical connection between parts. A device can include a first substrate, at least one electric component on or at least partially in a first surface of the first substrate, an adhesive on the first surface of the first substrate to temporarily attached the device to skin of a user, a contact pad electrically coupled to an electric component of the at least one electric component, the contact pad on or at least partially in a second surface of the substrate, the first surface opposite the second surface, and a conductive magnetic connector electrically and mechanically connected to the contact pad through a first conductive adhesive.
Abstract translation: 这里通常讨论的是包括或提供磁性可拆卸导电连接器以提供部件之间的电气和机械连接的方法和装置。 装置可以包括第一衬底，在第一衬底的第一表面上或至少部分地在第一衬底的第一表面中的至少一个电子部件，在第一衬底的第一表面上的粘合剂，以将装置临时附接到用户的皮肤， 衬垫，所述衬垫电耦合到所述至少一个电部件的电部件，所述接触垫位于所述衬底的第二表面上或者至少部分位于所述衬底的第二表面中，所述第一表面与所述第二表面相对，以及导电磁连接器，所述导电磁连接器电连接和机械连接 接触垫通过第一导电粘合剂。
-
公开(公告)号：WO2018009164A1
公开(公告)日：2018-01-11
申请号：PCT/US2016/040902
申请日：2016-07-02
Applicant: INTEL CORPORATION , ALEKSOV, Aleksandar , OSTER, Sasha N. , EID, Feras , LIFF, Shawna M. , SOUNART, Thomas L. , SWAN, Johanna M. , BICEN, Baris , RAO, Valluri R.
Inventor： ALEKSOV, Aleksandar , OSTER, Sasha N. , EID, Feras , LIFF, Shawna M. , SOUNART, Thomas L. , SWAN, Johanna M. , BICEN, Baris , RAO, Valluri R.
IPC: A41D13/002 , A41D1/00 , A41D27/24
Abstract: Embodiments of the invention include an active venting system. According to an embodiment of the invention, the active venting system may include a substrate having one or more seams formed through the substrate. In order to open the vents defined by the seams through the substrate, a piezoelectric layer may be formed proximate to one or more of the seams. Additional embodiments may include a first electrode and a second electrode that contact the piezoelectric layer in order to provide a voltage differential across the piezoelectric layer. In an embodiment the active venting system may be integrated into a garment. In such an embodiment, the garment may also include an electronics module for controlling the actuators. Additionally, conductive traces may be printed on the garment or sewn into the garment to provide electrical connections from the electronics module to each of the piezoelectric actuators.
Abstract translation: 本发明的实施例包括主动通气系统。 根据本发明的实施例，主动通气系统可以包括具有穿过基板形成的一个或多个接缝的基板。 为了打开由接缝限定的通过基板的通风口，可以在接近一个或多个接缝处形成压电层。 另外的实施例可以包括接触压电层的第一电极和第二电极，以便在压电层两端提供电压差。 在一个实施例中，主动通气系统可以被集成到服装中。 在这样的实施例中，服装还可以包括用于控制致动器的电子模块。 另外，导电迹线可以被印刷在衣服上或缝合到衣服中以提供从电子模块到每个压电致动器的电连接。
-
公开(公告)号：WO2018004868A1
公开(公告)日：2018-01-04
申请号：PCT/US2017/033383
申请日：2017-05-18
Applicant: INTEL CORPORATION
Inventor： EID, Feras , OSTER, Sasha N. , DOGIAMIS, Georgios C. , SOUNART, Thomas L. , ELSHERBINI, Adel A. , LIFF, Shawna M. , SWAN, Johanna M.
IPC: H01L41/113 , H01L41/047 , H01L41/22
Abstract: Embodiments of the invention include a temperature sensing device that includes a base structure that is positioned in proximity to a cavity of an organic substrate, an input transducer coupled to the base structure, and an output transducer coupled to the base structure. The input transducer includes a first piezoelectric material to generate vibrations which are transmitted on the base structure in response to input signals being applied to the input transducer. The output transducer includes a second piezoelectric material to receive the vibrations and to generate output signals which are used to determine a change in ambient temperature.
Abstract translation: 本发明的实施例包括温度感测装置，该温度感测装置包括位于有机衬底的空腔附近的基底结构，耦合到基底结构的输入变换器和耦合到基底结构的输出变换器 基础结构。 输入变换器包括第一压电材料以产生响应于施加到输入变换器的输入信号而在基底结构上传输的振动。 输出变换器包括第二压电材料以接收振动并产生用于确定环境温度变化的输出信号。
-
公开(公告)号：WO2017171883A1
公开(公告)日：2017-10-05
申请号：PCT/US2016/025761
申请日：2016-04-01
Applicant: INTEL CORPORATION
Inventor： OSTER, Sasha N. , EID, Feras , SWAN, Johanna M. , SOUNART, Thomas L. , ALEKSOV, Aleksandar , LIFF, Shawna M. , BICEN, Baris , RAO, Valluri R.
CPC classification number: G02B26/0858 , H01L27/20 , H01L41/094 , H01L41/0966 , H01L41/253
Abstract: Embodiments of the invention include a display formed on an organic substrate and methods of forming such a device. According to an embodiment, an array of pixel mirrors may be formed on the organic substrate. For example, each of the pixel mirrors is actuatable about one or more axes out of the plane of the organic substrate. Additionally, embodiments of the invention may include an array of routing mirrors formed on the organic substrate. According to an embodiment, each of the routing mirrors is actuatable about two axes out of the plane of the organic substrate. In embodiments of the invention, a light source may be used for emitting light towards the array of routing mirrors. For example, light emitted from the light source may be reflected to one or more of the pixel mirrors by one of the routing mirrors.
Abstract translation: 本发明的实施例包括形成在有机衬底上的显示器和形成这种器件的方法。 根据一个实施例，可以在有机衬底上形成像素镜阵列。 例如，每个像素镜都可围绕有机衬底平面外的一个或多个轴致动。 另外，本发明的实施例可以包括形成在有机衬底上的路由镜阵列。 根据一个实施例，每个路由反射镜可围绕有机衬底的平面外的两个轴致动。 在本发明的实施例中，可以使用光源朝向路由反射镜阵列发射光。 例如，从光源发射的光可以通过路由反射镜中的一个反射到一个或多个像素反射镜。
-
公开(公告)号：WO2017171854A1
公开(公告)日：2017-10-05
申请号：PCT/US2016/025653
申请日：2016-04-01
Applicant: INTEL CORPORATION
Inventor： OSTER, Sasha N. , EID, Feras , SWAN, Johanna M. , LIFF, Shawna M. , ALEKSOV, Aleksandar , SOUNART, Thomas L. , BICEN, Baris , RAO, Valluri R.
IPC: H01L41/04 , H01L41/047 , H01L41/18 , H01L41/27 , H01L41/331 , H01L41/332 , H01L41/314
Abstract: Embodiments of the invention include a piezo-electric mirror in an microelectronic package and methods of forming the package. According to an embodiment the microelectronic package may include an organic substrate with a cavity formed in the organic substrate. In some embodiments, an actuator is anchored to the organic substrate and extends over the cavity. For example, the actuator may include a first electrode and a piezo-electric layer formed on the first electrode. A second electrode may be formed on the piezo-electric layer. Additionally, a mirror may be formed on the actuator. Embodiments allow for the piezo-electric layer to be formed on an organic package substrate by using low temperature crystallization processes. For example, the piezo-electric layer may be deposited in an amorphous state. Thereafter, a laser annealing process that includes a pulsed laser may be used to crystallize the piezo-electric layer.
Abstract translation: 本发明的实施例包括微电子封装中的压电反射镜和形成封装的方法。 根据一个实施例，微电子封装可以包括具有在有机衬底中形成的空腔的有机衬底。 在一些实施例中，致动器被锚定到有机基底并且在腔体上延伸。 例如，致动器可以包括第一电极和形成在第一电极上的压电层。 可以在压电层上形成第二电极。 另外，可以在致动器上形成镜子。 实施例允许通过使用低温结晶工艺在有机封装衬底上形成压电层。 例如，压电层可以沉积为无定形状态。 之后，可以使用包括脉冲激光器的激光退火工艺来使压电层结晶。
-
公开(公告)号：WO2017052931A1
公开(公告)日：2017-03-30
申请号：PCT/US2016/048466
申请日：2016-08-24
Applicant: INTEL CORPORATION
Inventor： QIU, Shipeng , LIFF, Shawna , HELMS, Kayleen L. , HEPPNER, Joshua D. , ELSHERVINI, Adel A. , SWAN, Johanna M. , BARNES, Gary M.
IPC: H01L23/498 , H01L21/48
CPC classification number: H05K1/189 , H05K1/0278 , H05K1/028 , H05K1/036 , H05K1/144 , H05K3/0014 , H05K3/22 , H05K3/303 , H05K3/326 , H05K3/361 , H05K2201/0133 , H05K2201/0308 , H05K2201/041 , H05K2201/047 , H05K2201/057 , H05K2201/10007 , H05K2201/10128 , H05K2203/10 , H05K2203/104 , H05K2203/105 , H05K2203/1105 , H05K2203/1194
Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.
Abstract translation: 一种集成电路，其包括具有形状记忆材料（SMM）的基板，所述SMM处于第一变形状态，并且具有第一结晶构造和第一构造，所述SMM能够从第一构造变形为第二构造 ，SMM变为第二结晶学结构并且在接收到能量时变形回第一配置，SMM在接收到不同量的能量时返回到第一晶体结构; 以及附接到基板的电子部件。 在其他形式中，SMM处于第一变形状态并且具有第一聚合物构型和第一构型，SMM从第一聚合物构象变为第二聚合物构象并且从第一构型变形到第二构型，SMM 变化返回到第一聚合物构象并且在接收能量时变形回到第一构型。
-
50.发明申请MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME 审中-公开多芯片封装及其相互之间提供DIE-TO-DIE互连的方法
公开(公告)号：WO2010151350A1
公开(公告)日：2010-12-29
申请号：PCT/US2010/027035
申请日：2010-03-11
Applicant: INTEL CORPORATION , BRAUNISCH, Henning , CHIU, Chia-Pin , ALEKSOV, Aleksandar , AU, Hinment , LOTZ, Stefanie M. , SWAN, Johanna M. , SHARAN, Sujit
Inventor： BRAUNISCH, Henning , CHIU, Chia-Pin , ALEKSOV, Aleksandar , AU, Hinment , LOTZ, Stefanie M. , SWAN, Johanna M. , SHARAN, Sujit
IPC: H01L23/48
CPC classification number: H01L23/5385 , H01L21/6835 , H01L23/13 , H01L24/14 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/13099 , H01L2224/1403 , H01L2224/141 , H01L2224/16145 , H01L2224/16225 , H01L2224/17181 , H01L2224/32245 , H01L2224/45099 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73207 , H01L2224/73253 , H01L2224/81001 , H01L2224/81005 , H01L2224/81801 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06562 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/12042 , H01L2924/1461 , H01L2924/15153 , H01L2924/19107 , H01L2924/351 , H01L2924/00
Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).
Abstract translation: 多芯片封装包括具有第一侧面（111），相对的第二侧面（112）和从第一侧向第二侧延伸的第三侧面（213）的基板（110），第一模具（120） ）和附接到所述基板的第一侧的第二模具（130），以及邻近所述基板的第三侧并连接到所述第一模具和所述第二模具的桥接件（140） 。 基板的任何部分都不在桥下。 该桥在第一管芯和第二管芯之间形成连接。 或者，桥可以设置在衬底中的空腔（615,915）中，或者设置在衬底和裸片层（750）之间。 该桥可以构成一个有源管芯，并且可以使用引线键连接到衬底（241,841,1141,1541）。
