公开(公告)号：WO2021236673A1

公开(公告)日：2021-11-25

申请号：PCT/US2021/033010

申请日：2021-05-18

Applicant: LUMILEDS LLC

Inventor： JOST, Peter ,  TIMINGER, Andreas

IPC: B60Q1/34 ,  B60Q1/26 ,  B60Q1/00

Abstract: An automobile rear lighting includes a first emitter that emits a first light through a cover and a second emitter that emits a second light, different from the first light, through the cover such that an output light including the first light and the second light is emitted through the cover. The automobile rear lighting also includes a driving apparatus. The driving apparatus provides a first driving current to the first emitter and a second driving current to the second emitter. The driving apparatus adapts a magnitude of the first driving current and the second driving current based on at least one of at least one property of the cover or at least one optical component of the automobile rear lighting and a pre-defined color coordinates specification for the output light.

公开(公告)号：WO2021231947A1

公开(公告)日：2021-11-18

申请号：PCT/US2021/032583

申请日：2021-05-14

Applicant: LUMILEDS LLC

Inventor： KESSELS, Marcus Jozef Henricus

IPC: H04N13/271 ,  H04N13/254 ,  H04N13/207

Abstract: An imaging system includes multiple LED modules, a single image sensor, a controller, a processing unit and a depth map generator. Each LED module has a distinct angular emission profile and emits light having a distinct wavelength range. The image sensor detects light originating from at least two of the LED modules after reflection by an object in a field of view of the image sensor to provide an image sensor output. The controller controls the LED modules to turn on and off such that only one LED module emits light at a time. The processing unit processes the image sensor output to identify an intensity profile for the reflected light from each of the LED modules. The depth map generator determines an angular position of the object based at least on the intensity profile for the reflected light from each of the LED modules.

公开(公告)号：WO2021183644A1

公开(公告)日：2021-09-16

申请号：PCT/US2021/021702

申请日：2021-03-10

Applicant: LUMILEDS LLC

Inventor： DECKERS, Michael ,  HIN, Tze Yang ,  BONNE, Ronald

IPC: H01L25/16 ,  H01L23/538 ,  H01L33/48 ,  H01L33/62

Abstract: An LED array assembly may include a hybridized device and a flexible PCB. The hybridized device may include a micro-LED array mounted on a driver IC. The driver IC may include driver IC contact pads on a top surface of the driver IC. The flexible PCB may have a bottom surface, first contact pads on the bottom surface, second contact pads on the bottom surface, and contact bridges. Each of the contact bridges extends from one of the first contact pads to one of the second contact pads. Each of the driver IC contact pads is bonded to a corresponding one of the first contact pads of the flexible PCB.

公开(公告)号：WO2021142066A1

公开(公告)日：2021-07-15

申请号：PCT/US2021/012425

申请日：2021-01-07

Applicant: LUMILEDS LLC

Inventor： TAN, Loon-Kwang ,  HIN, Tze Yang

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/46 ,  H05K1/18 ,  H05K3/10 ,  H05K1/0203 ,  H05K1/181 ,  H05K2201/10106 ,  H05K3/0097 ,  H05K3/108 ,  H05K3/4605

Abstract: Circuit boards, LED lighting systems and methods of manufacture are described. A circuit board (200) includes a ceramic carrier (202) and a body (212) on the ceramic carrier. The body includes dielectric layers (204) and slots or vias (206) formed completely through a thickness of the dielectric layers. The slots are filled with a metal material. A conductive pad (208) is provided on a surface of each of the slots opposite the ceramic carrier.

公开(公告)号：WO2021134003A1

公开(公告)日：2021-07-01

申请号：PCT/US2020/066998

申请日：2020-12-24

Applicant: LUMILEDS LLC

Inventor： HIN, Tze Yang ,  WONG, Hung Khin

IPC: H01L25/075 ,  H01L27/15 ,  H01L33/64 ,  H01L33/62 ,  H01L25/16 ,  H05K1/18 ,  F21S41/141 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L2933/0066 ,  H01L33/647 ,  H05K1/141 ,  H05K1/184 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/1053

Abstract: A light-emitting diode (LED) package assembly (100) includes a substrate (102). The substrate includes a top surface, a bottom surface (122) and an opening formed through the substrate (102). The opening includes a first portion (104) adjacent the top surface and a second portion (106) adjacent the bottom surface (122) that is wider than the first portion (104) such that portions of the substrate (102) overhang the second portion (106) of the opening. Pads (124) are provided on a bottom surface of the portions of the substrate (102) that overhang the second portion (106) of the opening (102). The assembly also includes a hybridized device (210) in the opening. The hybridized device (210) includes a silicon backplane (214) that has a top surface, a bottom surface and interconnects on the top surface. The interconnects (148) are electrically coupled to the pads (124). The hybridized device also includes an LED array (212) on the top surface of the silicon backplane (214).

公开(公告)号：WO2021102096A1

公开(公告)日：2021-05-27

申请号：PCT/US2020/061205

申请日：2020-11-19

Applicant: LUMILEDS LLC

Inventor： HIN, Tze Yang ,  VAIDYANATHAN, Anantharaman ,  BANNA, Srini ,  BONNE, Ronald, Johannes

IPC: H01L25/075 ,  H01L27/15 ,  H01L33/62 ,  H01L33/64 ,  H01L33/00 ,  H01L23/00 ,  H01L33/50

Abstract: Methods of manufacturing a system are described. A method includes attaching a silicon backplane to a carrier and molding the silicon backplane on the carrier such that a molding material surrounds side surfaces of the silicon backplane to form a structure comprising a substrate with an embedded silicon backplane. The structure has a first surface opposite the carrier, a second surface adjacent the carrier, and side surfaces. At least one via is formed through the molding material and filled with a metal material. A metal layer is formed on a central region of the first surface of the structure. Redistribution layers are formed on the first surface of the structure adjacent the metal layer.

公开(公告)号：WO2019169014A1

公开(公告)日：2019-09-06

申请号：PCT/US2019/019871

申请日：2019-02-27

Applicant: LUMILEDS LLC

Inventor： SONG, Zhi Hua ,  SOER, Wouter

IPC: H05B33/08

Abstract: Systems, devices and methods are described herein. An integrated light emitting diode (LED) lighting system includes an electronics board. An alternating current (AC) input is disposed on the electronics board. Multiple strings of LED devices are disposed on the electronics board, each having an individual voltage threshold. A buck converter is disposed on the electronics board and is electrically coupled to provide a direct current (DC) current based on an AC current at the AC input. A switching circuit is disposed on the electronics board and is electrically coupled to the strings of LED devices to apply the DC current to each of the strings in a sequence beginning at a time when an instantaneous voltage level at the AC input reaches the individual threshold voltage of a first one of the strings of LED devices in the sequence.

公开(公告)号：WO2019126621A1

公开(公告)日：2019-06-27

申请号：PCT/US2018/067047

申请日：2018-12-21

Applicant: LUMILEDS LLC

Inventor： BONNE, Ronald

IPC: F21V23/00 ,  F21V23/06 ,  F21K9/20 ,  F21K9/90 ,  F21V15/01 ,  H05B33/08 ,  F21V29/70 ,  F21Y115/10

Abstract: Chip-on-board (COB) modular lighting systems and methods of manufacture are described herein. A system includes a COB assembly (110) including a thermally conductive plate (114) and a COB light- emitting diode (LED) device (112) thermally coupled to the thermally conductive plate (114). The COB LED device (112) includes multiple LED chips disposed on a surface of a substrate. The substrate includes first electrical power contacts (116) exposed from at least the surface. The system further includes an electronics board (120) that has second electrical power contacts (126). The electronics board (120) is attached to the COB assembly (110) such that the first (116) and second (126) electrical contacts are electrically coupled and the thermally conductive plate (114) is attached to the electronics board (120).

公开(公告)号：WO2017151876A1

公开(公告)日：2017-09-08

申请号：PCT/US2017/020384

申请日：2017-03-02

Applicant: IDAC HOLDINGS, INC.

Inventor： DEENOO, Yugeswar ,  DENG, Tao ,  STERN-BERKOWITZ, Janet, A. ,  LEE, Moon-il ,  BELURI, Mihaela, C. ,  PRAGADA, Ravikumar, V.

IPC: H04B7/024 ,  H04B7/06 ,  H04B7/08 ,  H04L5/00

Abstract: Methods and apparatus are described. A method, implemented in a wireless transmit/receive unit (WTRU) includes monitoring a first control channel search space (SS) associated with a first normal beam set comprising a first beam set. The WTRU initiates extended monitoring and monitors, subsequent to a trigger based on a measurement by the WTRU, a control channel SS associated with an extended beam set comprising the first beam set and one or more additional beam sets. The WTRU determines a second beam set from the extended beam set. The determination is based on a received control channel beam switch command or based on a control channel SS in which a beam switch command is received. The WTRU monitors a second control channel SS associated with a second normal beam set comprising the determined second beam set.

Abstract translation: 描述了方法和装置。 一种在无线发射/接收单元（WTRU）中实现的方法包括监测与包括第一波束组的第一法向波束组相关联的第一控制信道搜索空间（SS）。 在基于WTRU的测量的触发之后，WTRU发起扩展的监测并且监测与包括第一波束组和第一波束组的扩展波束组以及一个或多个附加波束组相关联的控制信道SS。 WTRU从扩展波束组中确定第二波束组。 该确定基于接收到的控制信道波束切换命令或基于其中接收波束切换命令的控制信道SS。 WTRU监视与包括确定的第二波束组的第二正常波束组相关联的第二控制信道SS。

公开(公告)号：WO2016164714A1

公开(公告)日：2016-10-13

申请号：PCT/US2016/026627

申请日：2016-04-08

Applicant: INTERDIGITAL PATENT HOLDINGS, INC.

Inventor： PELLETIER, Ghyslain ,  PANI, Diana ,  WANG, Guanzhou ,  ADJAKPLE, Pascal M.

IPC: H04W12/04 ,  H04L29/06 ,  H04W76/02

CPC classification number: H04W76/15 ,  H04L63/068 ,  H04L63/0846 ,  H04L63/205 ,  H04L2463/061 ,  H04W12/04 ,  H04W12/06 ,  H04W76/025 ,  H04W76/18 ,  H04W84/042 ,  H04W84/12 ,  H04W88/06

Abstract: A method and apparatus for configuring a Long Term Evolution (LTE)-controlled Wireless Local Area Network (WLAN) interface for a wireless transmit/receive unit (WTRU) are described. A method includes receiving LTE Radio Resource Configuration (RRC) signaling that provides parameters for the WTRU to configure the LTE-controlled WLAN interface. The LTE RRC signaling includes a set of WLAN access points (APs), an indication that the WTRU is permitted to autonomously initiate association with a WLAN within the set, a type of one or more bearers to use for the LTE-controlled WLAN interface, WLAN-related security information, and a configuration for the WTRU to report a status of an association with a WLAN AP. The WTRU selects a WLAN AP to associate to from the list and initiates association to the selected WLAN AP using at least the WLAN-related security information.

Abstract translation: 描述了用于配置用于无线发射/接收单元（WTRU）的长期演进（LTE）控制的无线局域网（WLAN）接口的方法和装置。 一种方法包括接收LTE无线电资源配置（RRC）信令，该信令为WTRU配置LTE控制的WLAN接口提供参数。 LTE RRC信令包括一组WLAN接入点（AP），允许WTRU自主地发起与该组内的WLAN的关联的指示，用于LTE控制的WLAN接口的一个或多个承载的类型， WLAN相关安全信息，以及用于WTRU报告与WLAN AP的关联状态的配置。 WTRU选择WLAN AP与列表相关联，并使用至少WLAN相关的安全信息来发起与所选WLAN AP的关联。