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    GENERATE WALLS ON SCREEN DEVICES TO FORM HOLES IN PARTS
    2.
    发明申请
    GENERATE WALLS ON SCREEN DEVICES TO FORM HOLES IN PARTS 审中-公开

    公开(公告)号：WO2022019904A1

    公开(公告)日：2022-01-27

    申请号：PCT/US2020/043073

    申请日：2020-07-22

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： BRIDEN, John J.

    IPC: B29C64/393 ,  B29C64/379 ,  B33Y40/20 ,  B33Y50/02 ,  B33Y80/00

    Abstract: According to examples, an apparatus may include a processor that may access data pertaining to a part to be fabricated from material elements in a slurry of a liquid and the material elements, the data identifying a configuration of holes to be formed in the part. The processor may also access a digital model of a screen device having a plurality of pores based on the accessed data, the screen device to be used to fabricate the part, and may determine locations on a surface of the digital model of the screen device that correspond to the identified configuration of the holes to be formed in the part. The processor may further generate, at the determined locations on the surface of the digital model of the screen device, a plurality of walls that are to form the holes in the part.

    DYNAMIC ALLOCATION OF SHARED BUS LANES
    4.
    发明申请
    DYNAMIC ALLOCATION OF SHARED BUS LANES 审中-公开

    公开(公告)号：WO2021167590A1

    公开(公告)日：2021-08-26

    申请号：PCT/US2020/018569

    申请日：2020-02-18

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： SEILER, Peter ,  BARTH, Justin ,  WARD, Shane

    IPC: G06F13/362

    Abstract: Examples are described herein for dynamically allocating shared bus lanes provided by a peripheral component bridge. A multiplexor may be operably coupled with the bridge via the shared bus lanes. A plurality of peripheral component slots may each be operably coupled with the multiplexor via a respective plurality of peripheral bus lanes. The multiplexor may multiplex the shared bus lanes to multiple different peripheral component slots. Circuitry may: interrogate each of the peripheral component slots to obtain information about a modular component installed in the peripheral component slot, wherein the information about the modular component includes a usable range of bus lanes and a transmission speed capability; and cause the multiplexor to dynamically allocate the number of shared bus lanes to the respective pluralities of peripheral bus lanes of the peripheral component slots based on the usable ranges and transmission speed capabilities of the installed modular components.

    DETECTING AND RESPONDING TO LIGHT SOURCE FAILURE
    5.
    发明申请
    DETECTING AND RESPONDING TO LIGHT SOURCE FAILURE 审中-公开

    公开(公告)号：WO2021101502A1

    公开(公告)日：2021-05-27

    申请号：PCT/US2019/061978

    申请日：2019-11-18

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： NOURI, Joseph ,  LESSMAN, Mark

    IPC: G02B27/01 ,  G06F3/01 ,  H05B45/10 ,  B81B7/02

    Abstract: In various examples, a head-mountable display ("HMD") may include a light source to emit light across a target region of a wearer, a light sensor, and a circuitry operably coupled with the light source and the light sensor. The circuitry may operate the light source to periodically emit light across the light sensor. Based on a determination that a time interval since the circuitry last received a signal from the light sensor satisfies a threshold, the circuitry may trigger a remedial action to cause the light source to cease emission of light across the target region of the wearer.

    ARRAYS OF ELECTRODES TO CONTROL PIXEL CONTRAST AT DISPLAY DEVICES
    7.
    发明申请
    ARRAYS OF ELECTRODES TO CONTROL PIXEL CONTRAST AT DISPLAY DEVICES 审中-公开

    公开(公告)号：WO2020101674A1

    公开(公告)日：2020-05-22

    申请号：PCT/US2018/061092

    申请日：2018-11-14

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： HSIEH, Hsing-Hung ,  CHANG, Chi Hao ,  VILLEGAS, Ann Alejandro

    IPC: G02F1/33

    Abstract: An example device includes a light source, a liquid crystal layer, and an array of pixel electrodes disposed between the light source and the liquid crystal layer. The array of pixel electrodes is to control orientation of liquid crystal of the liquid crystal layer to modulate light incident from the light source to produce an image composed of pixels. The example device further includes an array of scattering electrodes to selectively influence orientation of liquid crystal of the liquid crystal layer to degrade contrast of selected pixels of the image.

    DETECTING PRINTHEAD ISSUES
    9.
    发明申请
    DETECTING PRINTHEAD ISSUES 审中-公开

    公开(公告)号：WO2022010466A1

    公开(公告)日：2022-01-13

    申请号：PCT/US2020/041130

    申请日：2020-07-08

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： JOWKAR, Mohammad ,  GARCIA GARCIA, Luis ,  MANSELL, Rhys

    IPC: B41J29/38 ,  B41J29/393 ,  B29C64/30 ,  B33Y40/00 ,  B22F10/00 ,  B29C64/209 ,  B29C64/393 ,  B33Y50/02

    Abstract: According to one aspect, there is provided a method of detecting printhead issues in a printer. The method comprises obtaining an image to be printed, generating a first sub-pattern and a second sub-pattern, wherein the first sub-pattern in a pattern to be printed in a first pass comprising a pattern suitable to enable the detection of a printhead issue and wherein the second sub-pattern is the complementary pattern that completes the first sub-pattern such that printing the first and second sub-patterns is equivalent to printing the obtained image, printing the first sub-pattern on a print target, obtaining an image of the printed first sub-pattern, analysing the image of the printed first sub-pattern to determine the presence of a printhead issue and, where appropriate, performing a printhead maintenance operation, and printing the second sub-pattern on the print target.

    HEATSINKS FOR MULTIPLE COMPONENTS
    10.
    发明申请
    HEATSINKS FOR MULTIPLE COMPONENTS 审中-公开

    公开(公告)号：WO2021173131A1

    公开(公告)日：2021-09-02

    申请号：PCT/US2020/019896

    申请日：2020-02-26

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： WILTZIUS, Andrew L ,  CRANE, Robert Lee

    IPC: G06F1/20 ,  H05K7/20

    Abstract: An example heat transfer apparatus includes a first heatsink, having a first thermal resistance, to remove heat from a first component, a second heatsink, having a second thermal resistance different from the first thermal resistance, to remove heat from a second component, and a mounting structure supporting the first heatsink to couple the first heatsink to the first component. The second heatsink is supported by the first heatsink to couple the second heatsink to the second component.

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