公开(公告)号：WO2006028633A3

公开(公告)日：2006-03-16

申请号：PCT/US2005/028139

申请日：2005-08-09

Applicant: ADVANCED INTERCONNECTIONS CORPORATION ,  GOODMAN, Glenn ,  MURPHY, James, V.

Inventor： GOODMAN, Glenn ,  MURPHY, James, V.

IPC: H01R13/652 ,  H01R13/64 ,  H01R13/629 ,  H01R13/28 ,  H05K1/00

Abstract: A hermaphroditic terminal assembly (10) for connecting electrical devices includes an insulating support member (20) for supporting female sockets (22) and male pins (34), a number of female sockets (22), and a number of male pins (34). An intercoupling component (19) for connecting electrical devices includes two hermaphroditic terminal assemblies (16, 18) configured such that the first hermaphroditic terminal assembly (16) can be mated with the second hermaphroditic terminal assembly (18).

公开(公告)号：WO2006055307A3

公开(公告)日：2006-05-26

申请号：PCT/US2005/040248

申请日：2005-11-04

Applicant: ADVANCED INTERCONNECTIONS CORPORATION ,  GOODMAN, Glenn ,  EASTMAN, Gary D. ,  LANGON, Alfred J. ,  SAYDAM, Erol D.

Inventor： GOODMAN, Glenn ,  EASTMAN, Gary D. ,  LANGON, Alfred J. ,  SAYDAM, Erol D.

IPC: H01L23/32 ,  H05K7/10 ,  G01R1/04

Abstract: A compression device has a frame sized to accept an integrated circuit package and a pressor. The frame includes a surface defining an opening with an axis and at least one ramp extending from the surface. The ramp or ramps have upper and lower flat portions, substantially parallel with a plane perpendicular to the axis, and a sloped portion at an angle relative to the plane, the sloped portion connecting the upper and lower flat portions. The pressor is configured to engage the ramp and rotate in response to applied force. When the pressor is engaged with the sloped portion(s) of the ramp(s), this rotation causes movement of the pressor along the axis. However, when engagement between the ramps and the pressor is in the flat portions of the ramp, continued movement of the pressor along the axis is limited in spite of any continued rotation.

公开(公告)号：WO2004001912A1

公开(公告)日：2003-12-31

申请号：PCT/US2003/019830

申请日：2003-06-24

Applicant: ADVANCED INTERCONNECTIONS CORPORATION ,  PERUGINI, Michael ,  SAYDAM, Erol, D. ,  EASTMAN, Gary, D. ,  LANGON, Alfred, J. ,  PREW, Raymond, A.

Inventor： PERUGINI, Michael ,  SAYDAM, Erol, D. ,  EASTMAN, Gary, D. ,  LANGON, Alfred, J. ,  PREW, Raymond, A.

IPC: H01R13/648

CPC classification number: H01R12/716 ,  H01R12/52 ,  H01R13/187 ,  H01R13/405 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6477 ,  H01R13/6586 ,  H01R13/6591 ,  H01R13/6598

Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

Abstract translation: 一种用于在具有电接地电路和底盘接地电路的数字或模拟传输系统内接收接触阵列的相互耦合部件，所述互耦部件包括由电绝缘材料形成的并具有上表面和下表面的部分，所述部分包括多个 设置在其上表面上并且布置成预定占地面积的一个或多个屏蔽构件，该屏蔽构件由导电材料形成，该屏蔽构件设置在该段内并被配置为连接到该系统的底盘接地电路。 相互耦合部件可以包括在设置在片段上的多个孔内的导电触点阵列。 这些触点中的一个或多个可以被配置为与系统的电接地电路电连接。 相互耦合组件还可以包括位于信号触头之间的空腔，以调整信号触点之间的差分阻抗。

公开(公告)号：WO1991015881A1

公开(公告)日：1991-10-17

申请号：PCT/US1991002386

申请日：1991-04-08

Applicant: ADVANCED INTERCONNECTIONS CORPORATION

Inventor： ADVANCED INTERCONNECTIONS CORPORATION ,  MURPHY, James, V.

IPC: H01R09/09

CPC classification number: H01L21/67121 ,  H01R12/716 ,  H05K7/1023 ,  H05K7/1084

Abstract: An adapter to connect device leads (12) to contacts arranged in a rectangle on a circuit surface (30). The adapter has a body and leads (26) that extend outwardly, downwardly and then outwardly again in a pair of opposing curves to form feet which match the pattern on the circuit surface (30). The body has sites (16) for connecting with the device (10) and supports conductive elements connecting the leads to the sites. The adapter may connect gullwing-shaped device leads disposed in a rectangle (e.g., QFP) to contacts in a similar pattern. Strain relief elements (32) are shown. The body may include a stack of connected body portions. The device leads may be anchored in holes in the substrate, and may be bent portions of a lead frame sealed in a molded insulating body. Vertically extending resilient single-reed-shaped contacts (224) may connect to a surface of a downwardly extending section on a device package lead (214).

Abstract translation: 用于将设备引线（12）连接到布置在电路表面（30）上的矩形中的触点的适配器。 适配器具有主体和引线（26），其在一对相对的曲线中再次向外，向下和向外延伸，以形成与电路表面（30）上的图案相匹配的脚。 主体具有用于与设备（10）连接的位置（16），并且支撑将引线连接到现场的导电元件。 适配器可以将以矩形（例如，QFP）布置的鸥翼形装置引线连接到类似图案的触点。 示出了应变消除元件（32）。 主体可以包括连接的主体部分的堆叠。 装置引线可以锚定在基板的孔中，并且可以是被密封在模制绝缘体中的引线框架的弯曲部分。 垂直延伸的弹性单簧片形触头（224）可以连接到器件封装引线（214）上的向下延伸部分的表面。

公开(公告)号：WO2008067182A2

公开(公告)日：2008-06-05

申请号：PCT/US2007/084830

申请日：2007-11-15

Applicant: ADVANCED INTERCONNECTIONS CORPORATION ,  GOODMAN, Glenn

Inventor： GOODMAN, Glenn

CPC classification number: H01R13/2421 ,  H05K7/1061

Abstract: A male contact, a connector assembly of the type used to electrically connect electrical devices includes male contacts, and a method of manufacturing an electrical connector are disclosed.

Abstract translation: 公接头，用于电连接电气设备的类型的连接器组件包括阳触头，以及制造电连接器的方法。

公开(公告)号：WO2008006045A2

公开(公告)日：2008-01-10

申请号：PCT/US2007/072901

申请日：2007-07-06

Applicant: ADVANCED INTERCONNECTIONS CORPORATION ,  GOODMAN, Glenn

Inventor： GOODMAN, Glenn

CPC classification number: H01R13/2421 ,  G01R1/0483 ,  H01L23/4338 ,  H01L2924/0002 ,  H05K7/1069 ,  H01L2924/00

Abstract: An intercoupling component used to couple an array of electrical connection regions disposed on a first substrate to an array of electrical connection regions disposed on a second substrate. The intercoupling component includes an insulative support member including an array of holes extending therethrough, the array of holes located in a pattern corresponding to the array of electrical connection regions on the first substrate; and a plurality of terminals. Each terminal includes a socket including a socket head and a socket body, the socket defining a socket cavity; a pin including a pin head and a pin body, the pin head positioned within one of the array of holes, the pin body extending from the pin head and received at least partially within the socket cavity; and a resilient member configured to bias the socket head is biased away from the pin head.

Abstract translation: 用于将布置在第一衬底上的电连接区域阵列耦合到布置在第二衬底上的电连接区域阵列的相互耦合组件。 所述相互连接部件包括绝缘支撑构件，所述绝缘支撑构件包括延伸穿过其中的孔阵列，所述孔阵列位于与所述第一基板上的所述电连接区域阵列对应的图案中; 和多个终端。 每个端子包括：包括插座头和插座本体的插座，该插座限定插座腔; 包括销头和销主体的销，所述销头定位在所述孔阵列中的一个内，所述销主体从所述销头延伸并且至少部分地接收在所述插座腔内; 并且配置成偏压内六角头的弹性构件偏离销头。

公开(公告)号：WO2006028637A1

公开(公告)日：2006-03-16

申请号：PCT/US2005/028248

申请日：2005-08-09

Applicant: ADVANCED INTERCONNECTIONS CORPORATION ,  GOODMAM, Glenn ,  MURPHY, James, V.

Inventor： GOODMAM, Glenn ,  MURPHY, James, V.

IPC: H01R13/24

CPC classification number: H01R13/2421 ,  H01R12/714

Abstract: A socket terminal assembly (18) includes a socket body (40) having a first end (41) with a first opening to receive a contact element (200) and a second opening at a second end to receive a pin (54). A contact element (200), located in the first opening, is configured to contact the corresponding connection region of a printed circuit board (14); a pin has an end (59) adapted to contact an electrical contacting area of an integrated circuit package (12) and an opposite end (58) configured to be inserted within the opening of the socket body (40). A contact spring (46) in the second opening receives the pin (54) and applies a frictional force sufficient to retain the lower end (56) of the pin (54) within the opening of the socket body. A resilient member (60) is disposed within the opening between the contact element (200) and the contact spring (46). The resilient member (60) applies to the pin and contact element (200), in response to a downward force applied to the pin (54) or an upward force applied to the contact element (200), a force sufficient to overcome the frictional force of the contact spring (46). An intercoupling component (16) includes a socket support member having holes (20), each hole (20) receiving a corresponding socket terminal assembly (18).

Abstract translation: 插座端子组件（18）包括具有第一端（41）的插座主体（40），第一端（41）具有第一开口以接收接触元件（200），第二开口在第二端处以接收销（54）。 位于第一开口中的接触元件（200）构造成接触印刷电路板（14）的对应的连接区域; 销具有适于接触集成电路封装（12）的电接触区域的端部（59）和被配置为插入插座主体（40）的开口内的相对端部（58）。 第二开口中的接触弹簧（46）接收销（54）并施加足以将销（54）的下端（56）保持在插座主体的开口内的摩擦力。 弹性构件（60）设置在接触元件（200）和接触弹簧（46）之间的开口内。 响应于施加到销（54）的向下的力或施加到接触元件（200）的向上的力，弹性构件（60）施加到销和接触元件（200），足以克服摩擦 接触弹簧（46）的力。 相互联接部件（16）包括具有孔（20）的插座支撑构件，每个孔（20）接收相应的插座端子组件（18）。

公开(公告)号：WO1999014823A1

公开(公告)日：1999-03-25

申请号：PCT/US1997016297

申请日：1997-09-16

Applicant: ADVANCED INTERCONNECTIONS CORPORATION

Inventor： ADVANCED INTERCONNECTIONS CORPORATION ,  MURPHY, James, V. ,  MURPHY, Michael, J. ,  FISHER, Burton ,  TAYLOR, Robert

IPC: H01R09/09

CPC classification number: H01R13/2478 ,  H01R13/2485 ,  H05K3/325 ,  H05K7/1061 ,  H05K7/1084

Abstract: A ball grid array assembly (10) consists of a socket body (24) having a plurality of vias (30) extending therethrough, a plurality of electrically conductive contact assemblies (26) respectively disposed in corresponding vias (30), and a releasable cover plate (28). Each of the contact assemblies (26) includes a lower terminal end for engaging a terminal pad (14) on a circuit board (16), and further includes an upper multi-fingered contact arrangement (48) for engaging a ball contact (20) of a ball grid array package (12). Three separate embodiments are disclosed. In use, the ball grid array package (12) is received in assembled relation with the socket body (24) wherein the ball contacts (20) of the ball grid array package (12) are received into the vias (30) in engaging electrical communication with the upper contact ends of the contacts assemblies (26).

Abstract translation: 球栅阵列组件（10）由具有穿过其延伸的多个通孔（30）的插座本体（24）组成，分别设置在对应的通路（30）中的多个导电触头组件（26）和可释放的盖 板（28）。 每个接触组件（26）包括用于接合电路板（16）上的端子焊盘（14）的下终端，并且还包括用于接合球接触件（20）的上多个多指接触装置（48） 的球栅阵列封装（12）。 公开了三个单独的实施例。 在使用中，球栅阵列封装（12）以与插座主体（24）组装的关系接收，其中球栅阵列封装（12）的球触点（20）被接收到通孔（30）中，以接合电 与触头组件（26）的上接触端的连通。

公开(公告)号：WO1994028697A1

公开(公告)日：1994-12-08

申请号：PCT/US1994005174

申请日：1994-05-10

Applicant: ADVANCED INTERCONNECTIONS CORPORATION ,  MURPHY, James, V.

Inventor： ADVANCED INTERCONNECTIONS CORPORATION

IPC: H05K07/02

CPC classification number: H05K7/1023

Abstract: An intercoupling component (e.g. adapter or socket) (10) for interconnecting an integrated circuit (IC) package (22) to a printed circuit board (12) includes a molded polymer member (18) having alignment member (e.g. ribs) (26) extending between adjacent connection regions of the component. The molded ribs (26) assure accurate alignment of each connection lead (24) of the IC package (22) to connection regions (16) of the printed circuit board (12). The intercoupling component further includes resilient members (50), each member (50) associated with a connection lead (24) of the IC package (22) for assuring that reliable contact is maintained between each connection lead (24) and connection region (16) of the circuit board (12).

Abstract translation: 用于将集成电路（IC）封装（22）互连到印刷电路板（12）的相互耦合部件（例如，适配器或插座）（10）包括具有对准部件（例如肋）（26）的模制聚合物部件（18） 在部件的相邻连接区域之间延伸。 模制肋（26）确保IC封装（22）的每个连接引线（24）与印刷电路板（12）的连接区域（16）的精确对准。 所述互耦组件还包括弹性构件（50），每个构件（50）与所述IC封装（22）的连接引线（24）相关联，用于确保在每个连接引线（24）和连接区域（16）之间保持可靠的接触 ）电路板（12）。