Abstract:
A torque transfer apparatus including a torque transfer plate with reduced thermal stresses. The apparatus includes a housing and a pack including at least one pair of plates interacting to transfer torque. At least one of the plates includes a plurality of teeth with at least two slots to reduce thermal stresses.
Abstract:
A polishing article and its use as a polishing article for various substrates, especially for polishing a semiconductor wafer. The article is comprised of a mesh of splittable intermingled fibers and a binder material holding the fibers in the mesh. The fibers and binder material provide the polishing pad with an absorptive property that maintains the slurry chemistry and particles near the surface for effective polishing.
Abstract:
A polishing article and its use as a polishing article for various substrates, especially for polishing a semiconductor wafer. The article is comprised of a mesh of splittable intermingled fibers and a binder material holding the fibers in the mesh. The fibers and binder material provide the polishing pad with an absorptive property that maintains the slurry chemistry and particles near the surface for effective polishing.
Abstract:
A torque transfer apparatus including a torque transfer plate with reduced thermal stresses. The apparatus includes a housing and a pack including at least one pair of plates interacting to transfer torque. At least one of the plates includes a plurality of teeth with at least two slots to reduce thermal stresses.