Abstract:
A methods of coating certain materials onto a substrate, including coating a coating material and an edge material onto the substrate in a manner which may provide an improved thickness profile of the overall coating, by using the edge material to augment the thickness of the coating material edge, or by improving the coating material edge by using the edge material to affect the shape of the coating material edge, the products being useful, for example, in electrochemical cells. This coating method permits to control edge thickness and profile of coating.
Abstract:
Described are methods and products prepared from the methods, each of which include methods of coating certain materials onto a substrate, including coating a coating material and an edge material onto the substrate in a manner which may provide an improved thickness profile of the overall coating, and that may do so by using the edge material to augment the thickness of the coating material edge, or that may do so by improving the coating material edge by using the edge material to affect the shape of the coating material edge, the products being useful, for example, in electrochemical cells.
Abstract:
It has now been determined that a first coating layer may be applied to a substrate by a first coating die in a much thinner layer than its rheological properties and/or surface properties would normally allow. This is accomplished by using a second coating fluid dispensed from a second coating die acting as a "dynamic liquid squeegee" to transport, spread, even, or meter the first coating layer on the substrate by varying a gap between the second coating die and the substrate.
Abstract:
In one embodiment, a computer implemented system and method for selecting dimensions of a die is disclosed. The method may include prompting a user to select a coating uniformity required to produce a particular coated product with the die. The user may also be prompted to select a slot height of the die. In some embodiments, the user may specify a value for one or more dimensions of the die. The method may then determine the total indicated run-out (TIR) of the coated product as a function of the dimensions of the die not having a user specified value. In certain embodiments, the method provides a thermal treatment process for reducing the number of finishing (e.g., grinding) cycles needed to produce a desired die flatness. In another embodiment, a computer implemented method for designing a coating die to achieve a desired coating uniformity with a particular coating fluid having a specified rheological characteristic is disclosed.
Abstract:
A process and apparatus for producing a polymer coating with reduced defects is described. The process includes coating a solution of a polymerizable material and a solvent on a substrate, polymerizing a portion of the polymerizable material, and removing a major portion of the solvent after polymerization of the portion of polymerizable material. A further polymerization of any remaining polymerizable material can occur after removal of the solvent. The apparatus includes a webline for conveying a substrate from an unwind roll to a windup roll, a coating section proximate the unwind roll for coating a solution of a polymerizable material and a solvent on the substrate, a polymerization section downweb from the coating section for polymerizing a portion of the polymerizable material, and a solvent removal section downweb from the polymerization section for removing the solvent after polymerization of the portion of the polymerizable material.
Abstract:
The present method comprises providing a flexible web substrate ( e.g. , polymeric flexible web substrates) that forms at least part of a component of a device, coating so as to wet-out on and cover all or a substantial portion of a major surface on one side or both sides of the flexible web substrate with flowable polymeric material, while the flexible web substrate is moving in a down-web direction, and solidifying the polymeric material so as to form one cleaning layer on the major surface of one side or both sides of the flexible web substrate. The present invention can be utilized in a continuous in-line manufacturing process. In applications of the present invention where the flexible web substrate will not form a component of a device, the present invention broadly provides a method for cleaning particles from a flexible web of indefinite length. Each cleaning layer forms a substantially adhesive bond to the major surface that is readily removable without damaging or leaving a substantial residue of cleaning layer material on the major surface. A substantial number of the particles that were on this major surface are captured by and removable with the cleaning layer.