公开(公告)号：WO2022203565A1

公开(公告)日：2022-09-29

申请号：PCT/SE2022/050239

申请日：2022-03-10

Applicant: FINGERPRINT CARDS ANACATUM IP AB

Inventor： MO, Zhimin

IPC: G06K19/07 ,  G06V40/13 ,  H01L23/043 ,  H01L23/053 ,  H01L23/31 ,  H05K1/18 ,  H05K3/46

Abstract: A fingerprint sensor module (100) comprising: a carrier (102) comprising a first recessed portion (104) on a first side (106) of the carrier; a fingerprint sensing device (108) arranged in the first recessed portion of the carrier, the fingerprint sensing device comprising a fingerprint sensing surface (110); a second recessed portion (112) on a second side (114) of the carrier, opposite the first side, and at an edge of the carrier and a connection pad (116) arranged in the second recessed portion; and an electrical connection through the carrier connecting the fingerprint sensing device to the connection pad.

公开(公告)号：WO2022005368A1

公开(公告)日：2022-01-06

申请号：PCT/SE2021/050621

申请日：2021-06-23

Applicant: FINGERPRINT CARDS ANACATUM IP AB

Inventor： MO, Zhimin ,  SLOTTNER, Mats

IPC: G06K9/00 ,  B65B15/04 ,  G06K19/07722

Abstract: Method for manufacturing a biometric imaging module, the method comprising: providing (100) a carrier tape (200); forming (104) a sensor opening (204) and at least one contact pad opening (206) in the carrier tape, wherein the sensor opening is adjacent to the contact pad opening; and from a top side of the carrier tape, arranging (106) a biometric sensor (212) on the carrier tape such that a body (214) of the biometric sensor is arranged in the sensor opening and a conductive contact pad (216) of the biometric sensor is aligned with and accessible through the contact pad opening from a backside of the carrier tape, and such that a sensing surface of the biometric sensor is facing in the same direction as the top side of the carrier tape.