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公开(公告)号：WO2018089459A1
公开(公告)日：2018-05-17
申请号：PCT/US2017/060589
申请日：2017-11-08
Applicant: KLA-TENCOR CORPORATION
Inventor： BRAUER, Bjorn , BHATTACHARYYA, Santosh , SHIFRIN, Eugene , LEE, Hucheng , MURRAY, Benjamin , MATHEW, Ashok , BHASKAR, Chetana , GAO, Lisheng
Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.
Abstract translation: 提供了用于检测掩模版上的缺陷的系统和方法。 一个系统包括计算机子系统，该计算机子系统包括一个或多个图像处理部件，该图像处理部件采集由晶片的检查子系统产生的图像;主用户接口部件，向用户提供为晶片和标线器产生的信息， 用户以及提供一个或多个图像处理组件与主用户界面之间的接口的接口组件。 与当前使用的系统不同，一个或多个图像处理组件被配置用于通过将中继器缺陷检测算法应用于由一个或多个图像处理组件获取的图像来执行中继器缺陷检测，并且中继器缺陷检测算法被配置为检测缺陷 在晶片上使用热门阈值，并找出中继器缺陷的缺陷。
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2.发明申请SYSTEMS AND METHODS FOR CREATING PERSISTENT DATA FOR A WAFER AND FOR USING PERSISTENT DATA FOR INSPECTION-RELATED FUNCTIONS 审中-公开用于创建WAFER的持续数据并使用用于检查相关功能的数据的系统和方法
公开(公告)号：WO2009039486A2
公开(公告)日：2009-03-26
申请号：PCT/US2008/077203
申请日：2008-09-22
Applicant: KLA-TENCOR CORPORATION , BHASKAR, Kris , BHASKAR, Chetana , KULKARNI, Ashok , ROSENGAUS, Eliezer , CAMPOCHIARO, Cecelia , MAHER, Chris , DUFFY, Brian , KHULLAR, Aneesh , KOHLI, Alpa , BALASUBRAMANIAN, Lalita , BHATTACHARYYA, Santosh , MAHADEVAN, Mohan
Inventor： BHASKAR, Kris , BHASKAR, Chetana , KULKARNI, Ashok , ROSENGAUS, Eliezer , CAMPOCHIARO, Cecelia , MAHER, Chris , DUFFY, Brian , KHULLAR, Aneesh , KOHLI, Alpa , BALASUBRAMANIAN, Lalita , BHATTACHARYYA, Santosh , MAHADEVAN, Mohan
IPC: H01L21/66
CPC classification number: G06T7/001 , G06T1/20 , G06T2207/30148
Abstract: Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.
Abstract translation: 提供了用于创建晶片的持久数据并使用持久数据进行检查相关功能的各种系统和方法。 一个系统包括耦合到检查系统的检测器的一组处理器节点。 每个处理器节点被配置为在扫描晶片期间接收由检测器产生的图像数据的一部分。 该系统还包括分开耦合到每个处理器节点的存储介质阵列。 处理器节点被配置为将由处理器节点接收的图像数据的所有图像数据或选定部分发送到存储介质阵列，使得由检测器生成的图像数据或图像数据的所选部分 在扫描晶片期间存储在存储介质的阵列中。
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公开(公告)号：WO2014075055A1
公开(公告)日：2014-05-15
申请号：PCT/US2013/069635
申请日：2013-11-12
Applicant: KLA-TENCOR CORPORATION
Inventor： LIN, Jason , PARK, Allen , CHANG, Ellis , WALLINGFORD, Richard , RONG, Songnian , BHASKAR, Chetana
CPC classification number: G06T7/001 , G06T2207/30148
Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.
Abstract translation: 混合模式包括接收包括晶片的选定区域的一个或多个图像的检查结果，一个或多个图像包括一个或多个晶片管芯，其包括一组重复块，该组重复块是一组重复的单元。 此外，混合模式检查包括调整一个或多个图像的像素尺寸以将每个单元映射到块，并将其死亡到整数个像素。 此外，混合模式检查包括将第一晶片管芯与第二晶片管芯进行比较，以识别第一或第二晶片管芯中的一个或多个缺陷的发生，将第一块与第二块进行比较以识别一个或多个 第一或第二块中的缺陷，并且将第一细胞与第二细胞进行比较以识别第一或第二细胞中的一个或多个缺陷的发生。
