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公开(公告)号：WO2013095147A4
公开(公告)日：2013-08-22
申请号：PCT/NL2012050922
申请日：2012-12-21
Applicant: MICRONIT MICROFLUIDICS BV
Inventor： VAN T OEVER RONNY , BLOM MARKO THEODOOR , HANEVELD JEROEN , OONK JOHANNES , OLDE RIEKERINK MARINUS BERNARDUS , TIJSSEN PETER , TIGELAAR HENDRIK JAN HILDEBRAND , FEHR JEAN-NOEL , ROULET JEAN-CHRISTOPHE , GUPTA AMITAVA
CPC classification number: B81C1/00269 , B81B2201/058 , B81C3/001 , B81C2201/0132 , B81C2203/0118 , B81C2203/019 , C23F1/02 , H01L21/50 , H01L23/10 , H01L2924/0002 , Y10T428/239 , H01L2924/00
Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic,aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.
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公开(公告)号：WO2013095147A1
公开(公告)日：2013-06-27
申请号：PCT/NL2012050922
申请日：2012-12-21
Applicant: MICRONIT MICROFLUIDICS BV
Inventor： VAN T OEVER RONNY , BLOM MARKO THEODOOR , HANEVELD JEROEN , OONK JOHANNES , OLDE RIEKERINK MARINUS BERNARDUS , TIJSSEN PETER , TIGELAAR HENDRIK JAN HILDEBRAND , FEHR JEAN-NOEL , ROULET JEAN-CHRISTOPHE , GUPTA AMITAVA
CPC classification number: B81C1/00269 , B81B2201/058 , B81C3/001 , B81C2201/0132 , B81C2203/0118 , B81C2203/019 , C23F1/02 , H01L21/50 , H01L23/10 , H01L2924/0002 , Y10T428/239 , H01L2924/00
Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic,aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.
Abstract translation: 本发明涉及用于通过使用用于提供结合的中间薄膜金属层来结合例如由玻璃，硅，陶瓷，铝或硼制成的至少两个基板的方法，所述方法包括以下步骤：a） 提供所述两个衬底; b）在所述两个衬底中的第一衬底的至少一部分表面上沉积所述薄膜金属层; c）使第二衬底的表面与第一衬底的所述表面上的所述薄膜金属层接触，使得提供第二衬底和第一衬底上的薄膜金属层之间的结合; 以及d）至少局部地加强第二衬底和第一衬底上的薄膜金属层之间的结合。 本发明还涉及包括例如由玻璃，硅，陶瓷，铝或硼制成的两个基板和中间薄膜金属层的器件。
