LOW-PRESSURE LAMINATED CERAMIC DEVICES
    2.
    发明申请
    LOW-PRESSURE LAMINATED CERAMIC DEVICES 审中-公开
    低压层压陶瓷器件

    公开(公告)号:WO03030192A9

    公开(公告)日:2004-11-04

    申请号:PCT/US0225252

    申请日:2002-08-07

    Applicant: MOTOROLA INC

    Abstract: An intermediate low-pressure laminated ceramic device is formed from a plurality of layers of unfired ceramic material (20) each including ceramic particles in an organic binder. A polymer interfacial layer (22) having a glass transition temperature such that it flows at a temperature below a temperature required for the unfired ceramic layers to substantially deform, is deposited on one surface of each of the unfired ceramic layers. The unfired ceramic layers are stacked with an interfacial layer positioned between adjacent unfired ceramic layers in the stack. The stack is heated to a temperature greater than the glass transition temperature of the interfacial layers and a pressure is applied to the heated stack below approximately 1200 psi to fixedly bond the plurality of layers in the stack together.

    Abstract translation: 中间低压层压陶瓷装置由多层未焙烧陶瓷材料(20)形成,每层包含有机粘合剂中的陶瓷颗粒。 具有玻璃化转变温度的聚合物界面层(22)沉积在每个未煅烧的陶瓷层的一个表面上,该玻璃化转变温度使其在低于未焙烧陶瓷层所需的温度的温度下流动以基本变形。 未焙烧的陶瓷层层叠有位于堆叠中的相邻未烧结陶瓷层之间的界面层。 堆叠被加热到大于界面层的玻璃化转变温度的温度,并且将压力施加到低于约1200psi的加热堆叠,以将堆叠中的多个层固定地结合在一起。

    ELECTRICALLY ISOLATED VIA IN A MULTILAYER CERAMIC PACKAGE
    4.
    发明申请
    ELECTRICALLY ISOLATED VIA IN A MULTILAYER CERAMIC PACKAGE 审中-公开
    通过多层陶瓷包装电隔离

    公开(公告)号:WO0247148A3

    公开(公告)日:2003-05-15

    申请号:PCT/US0143858

    申请日:2001-11-19

    Applicant: MOTOROLA INC

    Abstract: A method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed within the via are disclosed. The method includes punching a first via (30) in a first layer (10), filling the first via with a cross-linkable paste (40), curing the paste to form an electrical insulator precursor and forming the via in the insulator precursor. The electrical connection formed includes an insulator made from a cross-linked paste supported by a substrate of a multilayer ceramic package and a conductive connection supported by the insulator.

    Abstract translation: 公开了一种在多层陶瓷封装中形成电隔离通孔的方法和形成在通孔内的电连接。 该方法包括冲压第一层(10)中的第一通孔(30),用可交联的糊剂(40)填充第一通孔,固化糊料以形成电绝缘体前体并在绝缘体前体中形成通孔。 形成的电连接包括由多层陶瓷封装的衬底支撑的交联膏和由绝缘体支撑的导电连接器制成的绝缘体。

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