公开(公告)号：WO2016174584A1

公开(公告)日：2016-11-03

申请号：PCT/IB2016/052375

申请日：2016-04-27

Applicant: ORMET CIRCUITS, INC.

Inventor： SHEARER, Catherine ,  BARBER, Eunsook ,  MATTHEWS, Michael

IPC: B23K35/26 ,  B23K1/00 ,  B23K35/30 ,  B23K35/02 ,  H01L23/498

CPC classification number: B23K35/025 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3026 ,  B23K35/3033 ,  B23K35/3046 ,  B23K35/3053 ,  B23K2203/56 ,  H01L23/488 ,  H01L23/49513 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29305 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29349 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/29373 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/32227 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83825 ,  H01L2224/8384

Abstract: A semiconductor die attach composition with greater than 60% metal volume after thermal reaction having: (a) 80-99 wt% of a mixture of metal particles comprising 30-70 wt% of a lead-free low melting point (LMP) particle composition comprising at least one LMP metal Y that melts below a temperature Tl, and 25-70 wt% of a high melting point (HMP) particle composition comprising at least one metallic element M that is reactive with the at least one LMP metal Y at a process temperature Tl, wherein the ratio of wt% of M to wt% of Y is at least 1.0; (b) 0-30 wt% of a metal powder additive A; and (c) a fluxing vehicle having a volatile portion, and not more than 50 wt% of a non-volatile portion.

Abstract translation: 在热反应后具有大于60％金属体积的半导体管芯附着组合物具有：（a）80-99重量％的包含30-70重量％的无铅低熔点（LMP）颗粒组合物的金属颗粒的混合物 包含至少一种在温度T1以下熔化的LMP金属Y和25-70重量％的高熔点（HMP）颗粒组合物，其包含至少一种在至少一种LMP金属Y上具有反应性的金属元素M 工艺温度T1，其中M的重量％与Y的重量％的比率为至少1.0; （b）0-30重量％的金属粉末添加剂A; 和（c）具有挥发性部分的助熔剂和不大于50重量％的非挥发性部分。