Abstract:
A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non¬ conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.
Abstract:
A simplified microelectronic transformer suitable for surface mount applications comprises a central spool (102) upon which the transformer primary (104) and secondary (106) windings are wound. A series of "E" shaped laminar core elements (108) are fitted within the spool in an alternating, interlocking fashion so as to form a substantially rectangular core assembly. A molded cover (120) is fitted within the central region of the wound bobbin assembly; the cover "snaps" into the core thereby retaining it in a substantially fixed position with respect to the spool and other transformer components. This arrangement obviates the need for varnish or other coatings to maintain the core elements in place, and improves the thermal and electrical performance of the transformer. A method of fabricating the simplified transformer is also disclosed.
Abstract:
An advanced connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a single port modular jack, and incorporates an insert assembly disposed in the rear portion of the connector housing. The insert assembly includes first and second substrates and a cavity adapted to receive one or more electronic or signal conditioning components. Heat removal features are also utilized within the jack to effectively dissipate heat produced by the electronic or signal conditioning components. The insert assembly is also optionally made removable from the jack housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet, 10/100, etc.). Methods for manufacturing the aforementioned embodiments are also disclosed.