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    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    1.
    发明申请
    METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
    制造半导体器件的方法

    公开(公告)号：WO2018042284A1

    公开(公告)日：2018-03-08

    申请号：PCT/IB2017/055049

    申请日：2017-08-22

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： YAMAZAKI, Shunpei ,  SATO, Masataka ,  IKEZAWA, Naoki ,  YANAKA, Junpei ,  IDOJIRI, Satoru

    IPC: H01L21/02 ,  B23K26/57 ,  B32B9/00 ,  B32B15/04 ,  B32B38/18 ,  G09F9/00 ,  H01L21/336 ,  H01L27/12 ,  H01L29/786

    CPC classification number: H01L31/1892 ,  H01L21/02345 ,  H01L21/02488 ,  H01L21/02694 ,  H01L21/6835 ,  H01L27/1225 ,  H01L27/1266 ,  H01L29/66969 ,  H01L31/1896 ,  H01L51/003 ,  H01L2221/68386 ,  H01L2224/83052 ,  H01L2924/35121

    Abstract: The yield of a manufacturing process of a semiconductor device is increased. The productivity of a semiconductor device is increased. A first material layer is formed over a substrate, a second material layer is formed over the first material layer, and the first material layer and the second material layer are separated from each other, so that a semiconductor device is manufactured. In addition, a stack including the first material layer and the second material layer is preferably heated before the separation. The first material layer includes one or more of hydrogen, oxygen, and water. The first material layer includes a metal oxide, for example. The second material layer includes a resin (e.g., polyimide or acrylic). The first material layer and the second material layer are separated from each other by cutting a hydrogen bond. The first material layer and the second material layer are separated from each other in such a manner that water separated out by heat treatment at an interface between the first material layer and the second material layer or in the vicinity of the interface is irradiated with light.

    Abstract translation: 半导体器件制造工艺的成品率增加。 半导体器件的生产率增加。 在衬底上形成第一材料层，在第一材料层上形成第二材料层，并且将第一材料层和第二材料层彼此分离，从而制造半导体器件。 另外，包括第一材料层和第二材料层的叠层优选在分离之前被加热。 第一材料层包括氢，氧和水中的一种或多种。 例如，第一材料层包括金属氧化物。 第二材料层包括树脂（例如聚酰亚胺或丙烯酸树脂）。 通过切割氢键将第一材料层和第二材料层彼此分开。 第一材料层和第二材料层以这样的方式彼此分离，使得在第一材料层和第二材料层之间的界面处或在界面附近通过热处理分离出的水被光照射。

    FILM-LIKE MEMBER SUPPORT APPARATUS
    2.
    发明申请
    FILM-LIKE MEMBER SUPPORT APPARATUS 审中-公开
    类似电影的会员支持设备

    公开(公告)号：WO2015170208A1

    公开(公告)日：2015-11-12

    申请号：PCT/IB2015/052801

    申请日：2015-04-17

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： KUMAKURA, Kayo ,  IDOJIRI, Satoru ,  OHNO, Masakatsu ,  TAKESHIMA, Koichi ,  HIRAKATA, Yoshiharu ,  YOKOYAMA, Kohei

    IPC: H01L21/683

    CPC classification number: B25B11/005 ,  B29C53/18 ,  B29L2007/002 ,  H01L21/68742 ,  H01L21/6875

    Abstract: A film-like member is supported in a flat shape by vacuum suction. A plurality of lift pins are arranged in a planar configuration and bear a film-like member placed on their upper ends. Tubular pads made of rubber for holding the film-like member by vacuum suction are attached to upper portions of the lift pins. The height of the lift pins can be adjusted by a screw fastening mechanism. The deformation of the film-like member can be corrected to a flat or concavely curved shape by suction from the pads. When the correction cannot be achieved by suction alone, the correction may be supplemented by ejection of air from a nozzle.

    Abstract translation: 膜状构件通过真空抽吸被支撑为平坦的形状。 多个提升销布置成平面构造并且承载放置在其上端的薄膜状构件。 由橡胶制成的用于通过真空吸附保持膜状构件的管状垫被附接到提升销的上部。 提升销的高度可以通过螺钉固定机构进行调整。 膜状构件的变形可以通过从衬垫的抽吸来校正为平坦或凹形弯曲的形状。 当仅通过抽吸不能实现校正时，可以通过从喷嘴喷出空气来补充校正。

    SEPARATION METHOD, DISPLAY DEVICE, DISPLAY MODULE, AND ELECTRONIC DEVICE
    4.
    发明申请
    SEPARATION METHOD, DISPLAY DEVICE, DISPLAY MODULE, AND ELECTRONIC DEVICE 审中-公开
    分离方法，显示装置，显示模块和电子装置

    公开(公告)号：WO2018025096A1

    公开(公告)日：2018-02-08

    申请号：PCT/IB2017/052836

    申请日：2017-05-15

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： YAMAZAKI, Shunpei ,  YASUMOTO, Seiji ,  KOBAYASHI, Yuka ,  IDOJIRI, Satoru

    IPC: H05B33/10 ,  G09F9/00 ,  G09F9/30 ,  H01L21/336 ,  H01L27/32 ,  H01L29/786 ,  H01L51/50 ,  H05B33/02

    Abstract: To increase the yield of the separation process. To produce display devices formed through the separation process with higher mass productivity. A first layer is formed using a material including a resin or a resin precursor over a substrate. Then, first heat treatment is performed on the first layer, whereby a first resin layer including a residue of an oxydiphthalic acid is formed. Then, a layer to be separated is formed over the first resin layer. Then, the layer to be separated and the substrate are separated from each other. The first heat treatment is performed in an atmosphere containing oxygen.

    Abstract translation:

    增加分离过程的收率。 为了生产具有更高批量生产率的通过分离过程形成的显示装置。 在衬底上使用包含树脂或树脂前体的材料形成第一层。 然后，对第一层进行第一热处理，由此形成包含氧联二邻苯二甲酸残基的第一树脂层。 然后，在第一树脂层上形成要分离的层。 然后，要分离的层和基底彼此分离。 第一次热处理是在含氧的气氛中进行的。

    FILM SUCTION MECHANISM
    5.
    发明申请
    FILM SUCTION MECHANISM 审中-公开
    电影吸引机制

    公开(公告)号：WO2015170211A1

    公开(公告)日：2015-11-12

    申请号：PCT/IB2015/052926

    申请日：2015-04-22

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： KUMAKURA, Kayo ,  IDOJIRI, Satoru ,  OHNO, Masakatsu ,  TAKESHIMA, Koichi ,  HIRAKATA, Yoshiharu ,  YOKOYAMA, Kohei

    IPC: B65H5/10 ,  H01L21/677

    CPC classification number: B25J15/0616 ,  B25J11/00 ,  B25J15/0004 ,  B25J15/0028 ,  B25J15/0061

    Abstract: A film suction mechanism is provided which can prevent a film-like member from warping or sagging for reliable suction, handing over, or the like of the film-like member. A film suction mechanism of the present invention is a film suction mechanism for processing or transferring a flexible film-like member. The film suction mechanism includes a suction unit having a function of attaching the film-like member thereto by suction and an air nozzle having a function of blowing pressurized air onto a first surface of the film-like member. The suction unit includes a plurality of suction pads. The suction unit is capable of attaching a second surface of the film-like member thereto by suction while the pressurized air is blown onto the first surface of the film-like member.

    Abstract translation: 提供了一种胶片吸引机构，其可以防止膜状构件翘曲或下垂以获得膜状构件的可靠抽吸，移交等。 本发明的吸膜机构是用于加工或转移柔性膜状部件的膜吸引机构。 薄膜抽吸机构包括具有通过抽吸将薄膜状构件附接到其上的功能的抽吸单元和具有将加压空气吹送到薄膜状构件的第一表面上的功能的空气喷嘴。 抽吸单元包括多个吸盘。 抽吸单元能够通过抽吸将薄膜状构件的第二表面附着在压力空气吹到薄膜状构件的第一表面上。

    SEPARATION METHOD, DISPLAY DEVICE, DISPLAY MODULE, AND ELECTRONIC DEVICE
    7.
    发明申请
    SEPARATION METHOD, DISPLAY DEVICE, DISPLAY MODULE, AND ELECTRONIC DEVICE 审中-公开
    分离方法，显示装置，显示模块和电子装置

    公开(公告)号：WO2018020333A1

    公开(公告)日：2018-02-01

    申请号：PCT/IB2017/052918

    申请日：2017-05-18

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： OHNO, Masakatsu ,  KUMAKURA, Kayo ,  WATANABE, Hiroyuki ,  YASUMOTO, Seiji ,  IDOJIRI, Satoru ,  ADACHI, Hiroki

    IPC: H01L21/02 ,  G02F1/1368 ,  G09F9/00 ,  G09F9/30 ,  H01L21/336 ,  H01L27/12 ,  H01L29/786 ,  H01L51/50 ,  H05B33/10

    Abstract: The yield of a separation process is improved. The mass productivity of a display device which is formed through a separation process is improved. A layer is formed over a substrate with use of a material including a resin or a resin precursor. Next, a resin layer is formed by performing heat treatment on the layer. Next, a layer to be separated is formed over the resin layer. Then, the layer to be separated and the substrate are separated from each other. The heat treatment is performed in an atmosphere containing oxygen or while supplying a gas containing oxygen.

    Abstract translation:

    分离过程的产量得到改善。 通过分离处理形成的显示装置的批量生产率得到改善。 使用包含树脂或树脂前体的材料在基板上形成层。 接下来，通过对层进行热处理来形成树脂层。 接着，在树脂层上形成要分离的层。 然后，要分离的层和基底彼此分离。 热处理在含氧的气氛中或在供应含氧气体的同时进行。

    FLEXIBLE DEVICE, DISPLAY DEVICE, AND MANUFACTURING METHODS THEREOF
    8.
    发明申请
    FLEXIBLE DEVICE, DISPLAY DEVICE, AND MANUFACTURING METHODS THEREOF 审中-公开
    柔性装置，显示装置及其制造方法

    公开(公告)号：WO2017115225A2

    公开(公告)日：2017-07-06

    申请号：PCT/IB2016/057852

    申请日：2016-12-21

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： YAMAZAKI, Shunpei ,  ADACHI, Hiroki ,  IDOJIRI, Satoru ,  YOSHIZUMI, Kensuke

    IPC: H01L21/02

    CPC classification number: H01L27/3262 ,  H01L27/1218 ,  H01L27/1225 ,  H01L27/1259 ,  H01L27/3258 ,  H01L29/24 ,  H01L29/66969 ,  H01L29/7869 ,  H01L51/0024 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5253 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2251/556 ,  Y02E10/549

    Abstract: A flexible device is manufactured at low temperatures. A second substrate is bonded to a first substrate by a first adhesive layer. A first insulating layer, a transistor, and a second insulating layer are formed over the second substrate. Then, the first substrate and the second substrate are separated from each other while being heated at a first temperature. The heat resistant temperatures of the first substrate, the second substrate, and the first adhesive layer are a second temperature, a third temperature, and a fourth temperature, respectively. Each of the first insulating layer, the second insulating layer, and the transistor is formed at a temperature higher than or equal to room temperature and lower than the fourth temperature. The third temperature is higher than the fourth temperature and lower than the second temperature. The first temperature is higher than the fourth temperature and lower than the third temperature.

    Abstract translation: 柔性器件在低温下制造。 第二基板通过第一粘合层粘合到第一基板。 第一绝缘层，晶体管和第二绝缘层形成在第二衬底上。 然后，第一基板和第二基板在第一温度下被加热的同时彼此分离。 第一基板，第二基板和第一粘合层的耐热温度分别为第二温度，第三温度和第四温度。 第一绝缘层，第二绝缘层和晶体管中的每一个都在高于或等于室温且低于第四温度的温度下形成。 第三温度高于第四温度且低于第二温度。 第一个温度高于第四个温度，低于第三个温度。

    SEPARATION APPARATUS FOR THIN FILM STACKED BODY
    9.
    发明申请
    SEPARATION APPARATUS FOR THIN FILM STACKED BODY 审中-公开
    薄膜堆叠体的分离装置

    公开(公告)号：WO2015170210A1

    公开(公告)日：2015-11-12

    申请号：PCT/IB2015/052898

    申请日：2015-04-21

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： OHNO, Masakatsu ,  IDOJIRI, Satoru ,  TAKESHIMA, Koichi ,  KUMAKURA, Kayo ,  HIRAKATA, Yoshiharu ,  YOKOYAMA, Kohei

    IPC: H01L21/02 ,  H01L21/683

    CPC classification number: B32B38/10 ,  B32B38/1858 ,  B32B43/006 ,  B32B2457/00 ,  H05K13/0486 ,  Y10T156/1105 ,  Y10T156/1132 ,  Y10T156/1906 ,  Y10T156/1944

    Abstract: A separation apparatus (1) for separating a thin-film flexible stacked body (3) from a component (16) where the thin-film flexible stacked body (3) including an element layer is formed over a rigid substrate (2) such as a glass substrate, a quartz substrate, a ceramic substrate, or a metal substrate is provided. The separation apparatus (1) mainly includes a fixing device (10) for fixing the substrate (2) of the component (16), suction jigs (11) for lifting the flexible stacked body (3) by suction to be separated, circular suction pads (13) that are brought into direct contact with the flexible stacked body (3) and attached to the flexible stacked body (3) by suction, and clamp jigs (9) for holding an edge of the flexible stacked body (3). A position sensor such as a laser measuring instrument for measuring or monitoring a separation state of the flexible stacked body may be used together.

    Abstract translation: 一种用于将薄膜柔性层叠体（3）从包括元件层的薄膜柔性层叠体（3）的部件（16）分离的分离装置（1）形成在刚性基板（2）上，例如 玻璃基板，石英基板，陶瓷基板或金属基板。 分离装置（1）主要包括用于固定部件（16）的基板（2）的固定装置（10），用于通过抽吸提升柔性堆叠体（3）以分离的吸附夹具（11），圆形抽吸 与柔性层叠体（3）直接接触并通过抽吸附接到柔性层叠体（3）的垫（13）和用于保持柔性层叠体（3）的边缘的夹具（9）。 可以一起使用诸如用于测量或监测柔性层叠体的分离状态的激光测量仪器的位置传感器。

    SUBSTRATE SEPARATION APPARATUS FOR STACKED BODY
    10.
    发明申请
    SUBSTRATE SEPARATION APPARATUS FOR STACKED BODY 审中-公开
    用于堆叠体的基板分离装置

    公开(公告)号：WO2015170209A1

    公开(公告)日：2015-11-12

    申请号：PCT/IB2015/052893

    申请日：2015-04-21

    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

    Inventor： OHNO, Masakatsu ,  IDOJIRI, Satoru ,  KIKUCHI, Kanpei ,  HIRAKATA, Yoshiharu ,  YOKOYAMA, Kohei

    IPC: H01L21/02 ,  H01L27/12 ,  H01L51/50 ,  H05B33/02 ,  H05B33/10 ,  H05B33/14

    CPC classification number: H01L21/463 ,  B32B38/10 ,  B32B43/006 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T156/1132 ,  Y10T156/1168 ,  Y10T156/1184 ,  Y10T156/1928 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1967 ,  Y10T156/1978

    Abstract: A wedge-shaped jig (6) is inserted into a gap between a first substrate (21) and a second substrate (22) at a corner (221) of the second substrate (22) and separation of the attached first substrate (21) and second substrate (22) starts to proceed; then, a second suction pad (53) of a second suction portion (51), which is the closest to the corner (221), moves upward. Then, first suction pads (43) of first suction portions (41a), (41b), and (41c) sequentially move upward such that one side of the second substrate (22) separates from the stacked body. Although the second substrate (22) warps as the separation of the second substrate (22) proceeds, each of the plurality of first suction pads (43) elastically deforms. Therefore, the first suction pads (43) can be prevented from being detached from the second substrate (22), and the substrate (22) can be securely separated from the stacked body.

    Abstract translation: 在第二基板（22）的角部（221）处将楔形夹具（6）插入到第一基板（21）和第二基板（22）之间的间隙中，并且分离附接的第一基板（21） 并且第二基板（22）开始进行; 那么最接近角部（221）的第二吸引部分（51）的第二吸盘（53）向上移动。 然后，第一吸引部（41a），（41b）和（41c）的第一吸盘（43）依次向上移动，使得第二基板（22）的一侧与层叠体分离。 尽管第二衬底（22）随着第二衬底（22）的分离进行而变形，但是多个第一吸附垫（43）中的每一个弹性变形。 因此，可以防止第一吸盘（43）与第二基板（22）脱离，并且可以将基板（22）与层叠体牢固地分离。

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