公开(公告)号：WO2006096378A1

公开(公告)日：2006-09-14

申请号：PCT/US2006/006912

申请日：2006-02-28

Applicant: SENSORMATIC ELECTRONICS CORPORATION

Inventor： CLARK, John, J. ,  LIAN, Ming-Ren ,  SHAFER, Gary, Mark ,  REYNOLDS, Jr., George, Anthony

IPC: H01L23/32

CPC classification number: G06K19/07749 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81143 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2224/95144 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/00014

Abstract: An integrated circuit package may include a substrate and an integrated circuit. The substrate may include at least one region, and a first magnetic material associated with the at least one region. The integrated circuit may have a second magnetic material associated therewith. The second magnetic material may be attracted to the first magnetic material to coupled the integrated circuit to the at least one region of the substrate. The IC package may be utilized in an RFID tag of an RFID system. An associated method for assembling an integrated circuit to a substrate is also provided.

Abstract translation: 集成电路封装可以包括衬底和集成电路。 衬底可以包括至少一个区域和与该至少一个区域相关联的第一磁性材料。 集成电路可以具有与其相关联的第二磁性材料。 第二磁性材料可以被吸引到第一磁性材料以将集成电路耦合到衬底的至少一个区域。 IC封装可以用在RFID系统的RFID标签中。 还提供了用于将集成电路组装到衬底的相关方法。