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发明授权
CN100374912C 电子部件安装体的制造方法 失效 - 权利终止

电子部件安装体的制造方法
摘要：
提供一种容易、低成本且具有高可靠性、高效制造电子部件安装体的方法，包括：通过将凸块电极(11、12)埋设进热可塑性树脂层(13)内部的方式，将具备凸块电极(11、12)的多个电子部件(10)安装在热可塑性树脂层(13)上的工序；在热可塑性树脂层(13)的与安装了电子部件(10)的面相反一侧的表面上，形成与凸块电极(11、12)导电接触的导电体(15、16)的工序；将热可塑性树脂层(13)按每一个电子部件(10)分割的工序。
摘要（英）：

A method of manufacturing an electronic device includes: mounting a plurality of electronic components to a thermoplastic resin layer so that the bump electrode is installed in the thermoplastic resin layer, each of the electronic components including a bump electrode; forming a conductor conductively connected with the bump electrode on a surface of the thermoplastic resin layer opposite to a surface on which the electronic components are mounted; and dividing the thermoplastic resin layer in units of each of the electronic components.

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