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发明授权
CN100457809C 热固性树脂组合物及其固化涂膜 失效 - 权利终止 许可

热固性树脂组合物及其固化涂膜
摘要：
本发明提供一种热固性树脂组合物及其固化涂膜，该树脂组合物水解性低，在焊料耐热性、化学耐性、密合性、电绝缘性等方面优良，且不含卤素、具有稳定的阻燃性，进一步的，还涉及适合用于半导体载带和挠性印刷线路板的阻焊剂的热固性树脂组合物及其固化涂膜，该树脂组合物耐折性优良，固化后的扭曲较小。该热固性树脂组合物含有：(A)一分子中具有1个以上羧基和乙烯类不饱和基的含羧基不饱和聚酯树脂、(B)一分子中具有2个以上环氧基的树脂、(C)胺类活性氢化合物和(D)下述通式(I)所示的磷酸酰胺化合物。
摘要（英）：

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which reduces hydrolyzing properties useful as a solder resist used in manufacturing printed-wiring boards and a marking ink, excels in heat resistance, chemical resistance, adhesion, electrical insulation properties and the like, is halogen-free, and has stabilized flame retardance, furthermore a thermosetting resin composition which excels in folding resistance suitably used in a semiconductor carrier tape and a solder resist for flexible printed-wiring boards and reduces warpage after curing, and its cured coating film.

SOLUTION: The thermosetting resin composition comprises (A) a carboxyl group-containing unsaturated polyester resin having one or more carboxyl groups and an ethylenically unsaturated group in one molecule, (B) a resin having two or more epoxy groups in one molecule, (C) an amine based active hydrogen compound, and (D) a phosphoric acid amide compound represented by formula (I).

COPYRIGHT: (C)2005,JPO&NCIPI

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