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发明公开
CN101002312A 层压系统、IC薄片、IC薄片卷、以及IC芯片的制造方法 失效 - 权利终止

层压系统、IC薄片、IC薄片卷、以及IC芯片的制造方法
摘要：
从衬底上剥离薄膜集成电路，并且为了提高制造产量有效地密封剥离的薄膜集成电路。本发明提供一种层压系统，包括：传送装置，用于传送提供有多个薄膜集成电路的衬底；第一剥离装置，用于将薄膜集成电路的第一表面结合到第一薄片构件，以从该衬底剥离该薄膜集成电路；第二剥离装置，用于将薄膜集成电路的第二表面结合到第二薄片构件，以从第一薄片构件剥离薄膜集成电路；和密封装置，用于在第二薄片构件和第三薄片构件之间插入该薄膜集成电路，以用第二薄片构件和第三薄片构件密封该薄膜集成电路。
摘要（英）：

Thin film integrated circuits are peeled from a substrate and the peeled thin film integrated circuits are sealed, efficiently in order to improve manufacturing yields. The present invention provides laminating system comprising transporting means for transporting a substrate provided with a plurality of thin film integrated circuits; first peeling means for bonding first surfaces of the thin film integrated circuits to a first sheet member to peel the thin film integrated circuits from the substrate; second peeling means for bonding second surfaces of the thin film integrated circuits to a second sheet member to peel the thin film integrated circuits from the first sheet member; and sealing means for interposing the thin film integrated circuits between the second sheet member and a third sheet member to seal the thin film integrated circuit with the second sheet member and the third sheet member.

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