A sputtering target of Sb-Te alloy sintering product from atomized powder consisting of substantially spherical particles of an Sb-Te alloy, characterized in that the spherical atomized powder consists of particles having been flattened by crushing, and that flat particles exhibiting a ratio of minor axis to major axis (flattening degree) of = 0.6 occupy = 50% of the whole particles. Further, there is provided such a target of Sb-Te alloy sintering product characterized in that particles whose major axis directions align within +-45 DEG against the direction parallel to target surface occupy= 60% of the whole particles. Still further, there is provided such a target of Sb-Te alloy sintering product characterized in that the oxygen content of the target is = 1500 wtppm. Thus, the structure of Sb-Te alloy sputtering target can be uniformalized and miniaturized, thereby inhibiting cracking of the sintered target and preventing arcing at the time of sputtering. Moreover, any surface ruggedness attributed to sputter erosion can be reduced, thereby enabling production of an Sb-Te alloy sputtering target of high quality.