The copper tracks of circuit supports require, for equipping with electronic components, a coating with a good corrosion resistance as well as with the ability of being repeatedly soldered or being bonded. These properties are fulfilled by a system of layers that contains an intermediate layer made of autocatalytically deposited nickel, on which a palladium layer is deposited by charge transfer. In order to ensure a reliable adhesion, a lack of pores and a good homogeneity, the bath for depositing the palladium layer contains a copper compound. In order to passivate the palladium layer, the system of layers can be provided with a final layer made of gold that is deposited by charge transfer and/or autocatalytically.