A process for producing a multilayer ceramic substrate, in which with respect to a multilayer ceramic substrate prepared by non-shrinking process, there can be avoided flawing of a wiring conductor formed on a surface of the multilayer ceramic substrate. On at least one major surface of a laminate composed of, superimposed one upon another, multiple ceramic green sheets (11) for substrate containing a ceramic material powder, shrinkage inhibiting green sheets (21,25) containing an inorganic material powder not sintered at firing temperature for the ceramic green sheets (11) for substrate are disposed so as to, along at least portion of the periphery of the major surface, realize exposure of the portion or the vicinity thereof, thereby obtaining a composite laminate. The composite laminateis fired under such conditions that the ceramic material powder is sintered but the inorganic material powder is not sintered. Thereafter, the shrinkage inhibiting green sheets (21,25) are removed. In multilayer ceramic substrate (10t), protrusions (12x,12y) are produced along at least portion of the periphery of major surface (11t).