The invention relates to a method for producing a circuit board, comprising the steps as follow: a conductive relief pattern comprising a first plating-cover layer, a first metallic layer and a second plating-cover layer, which are stacked in serial, and which is consistent to a first circuit pattern, is formed on a seed crystal layer stacked on a carrier; the carrier and an insulator are stackedand pressed together, so that the surface of the carrier having the conductive relief pattern faces the insulator; the conductive relief pattern is transcribed into the insulator by removing the carrier; a conductive pattern comprising serially stacked a third plating-cover layer and a second metallic layer and is consistent to the second circuit pattern is formed on the surface of the insulator having the transcribed conductive relief pattern; the first plating-cover layer and the seed crystal layer are removed; and the first metallic layer and the second metallic layer are removed. The invention provides a circuit board with high density circuit pattern without increasing the quantity of the insulator.