According to the present invention, a plurality of semiconductor devices having semiconductor chips 13 molded on a semiconductor package substrate 1 by a molding resin 15 can be manufactured by forming recesses 10 around each semiconductor package substrate 1 composing a substrate 8 for a BGA package, and in the state where a molding resin 15 is filled on the substrate 8 including the recesses 10 for resin molding, cutting the substrate 8 and the molding resin 15 along partition lines 9.