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发明授权
CN101202262B 半导体装置及其制造方法 有权

半导体装置及其制造方法
摘要：
本发明涉及一种半导体装置，其包含：多个焊球，其提供在上层封装上；以及多个焊盘，其提供在下层封装上并且直接连接到所述多个焊球，其中所述多个焊盘中至少有一个用作基准标记。此外，多个焊盘中至少有一个的形状与其它焊盘的形状不同并且焊盘中至少有一个的面积大体上等于其它焊盘的面积。
摘要（英）：

The invention relates to a semiconductor device, which includes: a plurality of solder balls provided on the top part of an encapsulation, and a plurality of bonding pads provided on the lower part of the encapsulation and directly connected with the solder balls, at least one of the solder balls is used for a reference mark. Furthermore, at least one of the bonding pads has a shape different from that of the others, and one of the bonding pads has a area equal to that of the others.

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