The invention relates to a method for producing a low dielectric constant silicon coating consisting in a) in applying a film-forming silicon composition to a support surface, wherein said silicon composition comprises: (i) at least one type of film-forming silicon cross-linking resin, (ii) at least one type of alpha, omega-hydroxylated substantially linear heat-degradable silicon oil, and (iii) at least one type of solvent for compatibilising the silicon resin (i) and silicon oil (ii), b) in simultaneously or sequentially removing the solvent (iii), preferably by heating, and c) in boiling the film-forming silicon composition. A silicon coating obtained by carrying out the inventive method and an integrated circuit comprising said silicon coating in the form of an electric insulator are also disclosed.