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发明授权
CN101303531B 晶片卡盘和形成晶片卡盘的方法 失效 - 权利终止

晶片卡盘和形成晶片卡盘的方法
摘要：
描述了一种用于光刻设备的晶片卡盘，所述晶片卡盘包括：低热膨胀玻璃陶瓷衬底；硅化碳化硅层；和粘结层，所述粘结层包括强度为至少大约5兆帕的硅酸盐，所述粘结层将硅化碳化硅层与衬底结合。还描述了一种形成用于光刻设备的晶片卡盘的方法，所述方法包括：将粘结溶液涂覆在低热膨胀玻璃陶瓷衬底和硅化碳化硅层这两者或其中之一的一部分上；并使所述衬底和硅化碳化硅层接触，以将所述衬底和所述硅化碳化硅层结合在一起。
摘要（英）：

A wafer chuck for use in a lithographic apparatus is described, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus is described, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

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