The invention relates to a method for easily manufacturing a light-emitting device which carries light-emitting chips on a substrate and is configured on the outer side thereof with a transparent resin comprising phosphor. The method for manufacturing the light-emitting device comprises: a step of carrying, namely carrying the light-emitting chips (3) on the substrate (20); a step of dome forming,namely utilizing a droplet discharge device to upward discharge droplets so as to forming a transparent resin part (4) on the substrate (20) and a phosphor layer (5) which comprises the phosphor andis formed on the outer side of the transparent resin part (4), wherein the transparent resin part (4) is filled with the light-emitting chips (3) and the outer side of the transparent resin part (4) is covered to a shape of dome; a step of forming a reflecting layer, namely forming the reflecting layer (6) near a position contacted with the substrate on the outer side of the dome-shaped transparent resin part (4) and the phosphor layer (5). The step of dome forming can also comprise a step of sedimentation, namely causing the phosphor in the transparent resin to subside to the dome surface nearby before the discharged transparent resin is solidified.