Disclosed is a light-emitting device (1) comprising an LED chip (10), a mounting board (20) on which the LED chip is mounted, a sealing portion (50) which is composed of a sealing resin material for sealing the LED chip, and a lens (60) made of a transparent resin material. The lens (60) has a recessed portion (40) in the bottom and is fixed to the mounting board (20) in such a manner that the sealing portion (50) is housed in the recessed portion (40). Since the sealing portion is surrounded by the transparent resin lens, the linear expansion coefficient difference between the sealing portion and the surrounding area thereof can be reduced in this light-emitting device. Consequently, there can be suppressed generation of voids in the sealing portion at low temperatures.