There are provided an aligning device that can reliably correct misalignment between electronic components and can increase the accuracy in aligning the electronic components, a bonding apparatus equipped with the aligning device, and an aligning method. Since an image-taking port 21 protrudes inward from an outer surface of a chamber 3 so as to define a space 11, even when the chamber 3 moves together with a second block member 28, an image recognizing device 47 can be provided in the space 11 so as to be prevented from interfering with the motion of the chamber 3. This allows the chamber 3 to freely move without any restriction. As a result, one of a first block member 12 and the second block member 28 can be freely moved relative to the other without being restricted by the placement of the image recognizing device 47, and a first wafer W1 and a second wafer W2 can be aligned reliably.