The invention discloses a semiconductor packaging part and a manufacturing method thereof. The semiconductor packaging part provides a carrier which is provided with a plurality of connecting pads on the surface so as to position the carrier on the lower surface of a lead frame chip holder correspondingly, wherein, the size of the carrier plane is more than the size of the chip holder plane so asto expose out of the connecting pad; at least one chip is arranged on the surface of the lead frame chip holder by connection, and the chip is connected with the carrier connecting pad and a lead frame foot by electricity with a multi-welding line, then an packaging colloid which covers the chip, the welding line, part of the carrier as well as the lead frame is formed, which leads the lower surface of the carrier and the foot to partially expose out of the packaging colloid, thereby increasing an electricity input/output (I/O) by the connecting pad of the carrier, solving the problem that glue overflow happens in an packaging molding press operation and complex processes are caused due to extra feet which are increasingly arranged in the chip holder in the prior, and avoiding the problemthat process steps and cost are increased as the separating operation of extra foot is conducted, and the problems of crack and loss, moisture intrusion and oxidation due to insufficient covering of the packaging part after the extra foot is separated.