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发明授权
CN101395710B 安装方法、带有电气部件的基板以及电气装置 失效 - 权利终止

安装方法、带有电气部件的基板以及电气装置
摘要：
本发明涉及安装方法、带有电气部件的基板以及电气结构。制造可靠性较高的电气装置。粘接剂层(20)含有有热硬化性树脂和放射线硬化性树脂，粘接剂层(20)的一部分与电气部件(15)的边缘相比露出到外侧。放射线(29)不透过电气部件(15)，在粘接剂层(20)的位于电气部件(15)的正背面的部分，放射线硬化性树脂不聚合，在露出部分(26)中放射线硬化性树脂进行聚合。电气部件(15)由聚合的放射线硬化型树脂固定，所以，当对电气部件(15)进行加热按压时，不会引起电气部件(15)的位置偏移。
摘要（英）：

The present invention relates to a mounting method, a board with electrical component, and an electrical apparatus. An adhesive layer (20) contains a thermosetting resin and a radiation-curable resin. A part of the adhesive layer (20) overlaps from the edges of an electrical component (15). Radiation (29) is not transmitted through the electrical component (15). Therefore, the radiation-curable resin is not polymerized at the portion of the adhesive layer (20) positioned just at the rear of the electrical component (15) but polymerized at the projecting portions (26). Since the electrical component (15) is fixed by the polymerized radiation-curable resin, the electrical component (15) is not positionally displaced when the electrical component (15) is heated and pressed.

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