An insulating resin layer for use in production of a multilayer printed wiring board through hot press molding. There is provided an insulating resin layer having, superimposed one upon another, at least one of each of a first layer and a second layer, characterized in that the first layer after hot press molding has a specific inductive capacity of 3.2 or below at a frequency of 1 MHz, and that the second layer after hot press molding has a linear expansion coefficient of 40 ppm/ DEG C or below at 35 DEG to 85 DEG C. Further, there is provided a multilayer printed wiring board characterized by being obtained by superimposing this insulating resin layer on at least one major surface of inner-layer circuit board and conducting hot press molding thereof.