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发明公开
CN101409277A 包括电磁屏蔽的SMD元件的组件、方法及使用 失效 - 权利终止

包括电磁屏蔽的SMD元件的组件、方法及使用
摘要：
本发明涉及电子元件组件，包括：至少一SMD元件(11)，该SMD元件包括由边缘(112)限定的多个外部表面(111)及至少两个电端子(113)；所述电子元件组件还包括用于限制与SMD元件的电磁耦合的电磁屏蔽(12)及位于至少一所述表面和所述电磁屏蔽之间的电绝缘层(13)。本发明还涉及制造电子元件组件的方法及电子元件组件的使用。本发明提供了在混合模拟数字环境中适于集成在衬底上的电子元件组件。本发明的优点在于预定的SMD元件可被独立屏蔽从而使能增加衬底上的元件密度。
摘要（英）：

The invention relates to an electronic component assembly comprising at least one SMD component (11) comprising a number of external surfaces limited by edges and at least two electrical terminals (113), an electromagnetic screen (12) for limiting the electromagnetic coupling to and from the SMD component or components, and an electrically insulating layer (13) located between at least one of the surfaces and the electromagnetic screen. The invention furthermore relates to a method of manufacturing an electronic component assembly and to the use of an electronic component assembly. The object of the present invention is to provide an electronic component assembly that is suitable for integration on a substrate in a mixed analogue digital environment. An advantage of the invention is that a predefined arrangement of SMD components, can be independently shielded to allow for an increased density of components on a substrate.

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