The invention provides a negative photosensitive polyimide material. The material contains polyimide which has a structure showed in the below formula (I), wherein n/(n+m)=0.5- 1, and values of n and m make the number average molecular weight of a polyimide main chain between 20,000 and 100,000; Ar is an aryl group with a tetravalent organic group of aromatic tetracarboxylic dianhydride, R1 and R2 are both groups with divalent organic groups of fatty group or/ and aromatic diamine, and at least one of Ar, R1 and R2 has one or two groups showed in the structural formula (II) and (III) as the side chain structure, wherein Y is a looped structure of epoxy resin provided with double bond and triple bond of carbon. The negative photosensitive polyimide material is a photosensitive high polymer material with photosensitive groups, the resolution capability of the photoetched graphics can be up to between 0.8 and 1 micron, and can be applied to a tectorial membrane, a basement membrane and an adhesive layer of a flexible circuit board.