The invention discloses a method for soldering ZrO2 ceramic and Al2O3 ceramic without pressure. The method comprises the following steps: (1) preparation of a TiH2 paste; (2) application of the TiH2 paste; (3) treatment of the soldered surface of an Al2O3 ceramic part; and (4) non-pressure assembly and vacuum soldering. The method is characterized by preserving heat for a certain period at least two different temperatures, including a start decomposition temperature and a soldering temperature under a vacuum condition higher than TiH2 and the vacuum degree is superior to 8*10<-3>Pa in the step of vacuum soldering; slowly heating before the soldering temperature is achieved; and finally, slowing cooling to room temperature. The method can realize non-pressure connection of the zirconium oxide ceramic and the aluminum oxide ceramic, is simple and economic, is suitable for large-scale production, and is applicable to connections of various joint modes. The prepared connecting piece has areliable structure, and can be used in occasions of loading and medium-low temperature application.