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Invention Grant
CN101504810B 电子设备、电子元件的保持方法及电子设备的制造方法 失效 - 权利终止

  • Patent Title: 电子设备、电子元件的保持方法及电子设备的制造方法
  • Patent Title (English): Electronic device, method for holding electronic component, and method for manufacturing electronic device
  • Application No.: CN200910126756.X
    Application Date: 2009-01-24
  • Publication No.: CN101504810B
    Publication Date: 2011-05-18
  • Inventor: 森本淳
  • Applicant: 株式会社东芝
  • Applicant Address: 日本东京都
  • Assignee: 株式会社东芝
  • Current Assignee: 株式会社东芝
  • Current Assignee Address: 日本东京都
  • Agency: 北京银龙知识产权代理有限公司
  • Agent 张敬强
  • Priority: 2008-021908 2008.01.31 JP
  • Main IPC: G09F9/00
  • IPC: G09F9/00
电子设备、电子元件的保持方法及电子设备的制造方法
Abstract:
本发明提供一种电子设备，其特征在于，具有：框体；设置在上述框体内侧的电子元件；和设置在上述框体内壁和上述电子元件之间，保持上述电子元件的保持部件，上述电子元件主面中第1端面侧的第1区域用上述保持部件保持，而与上述电子元件的上述主面中上述第1端面侧相反的第2端面侧的第2区域，不用上述保持部件保持。
Abstract(English):

An electronic device includes: a housing; an electronic component provided inside the housing; and a holding member provided between an inner wall of the housing and the electronic component and configured to hold the electronic component. The holding member is configured to hold a first region of a major surface of the electronic component located on a first end surface side, and the holding member is configured not to hold a second region of the major surface of the electronic component located on a second end surface side opposed to the first end surface side.

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