The invention provides a method and a device for disassembling electronic components from waste printed circuit boards (PCB) and recovering soldering tin. The method comprises the following steps: placing the PCB with the electronic components in a temperature-setting tin-melting furnace in a manner that the PCB faces up; grabbing larger electronic components manually and feeding the PCB containing smaller electronic components and soldering tin to the conveyor belt after the soldering tin is melted by heat, wherein, an automatic-control electrical heating and warming device is additionally arranged at the bottom of the conveyor belt; pinning down the PCB by a hob and forwarding the PCB, and eliminating the electronic components and the soldering tin by a scraper arranged on the rear side of the hob, so that the soldering tin can be separated from the electronic components on the PCB through the successive coordinating operation of hobs and scrapers in a plurality of groups; recovering the soldering tin by a material-receiving pot; and subjecting the peculiar smell and harmful gases generated by heating the PCB to negative-pressure air draft and absorption treatment and discharging the gases until the discharge standards are met. The invention is suitable for treating PCBs with various thicknesses and recovering electronic components of various types and models; the invention has the advantages of high speed, high efficiency, no pollution, high operability and advanced technology; and the invention contains a novel and environment-friendly method and an equipment for disassembling the waste printed circuit boards and recovering treatment of soldering tin.