Provided is a thin solid-state imaging device which uses a flexible wiring board and has high rigidity, improved accuracy and high reliability. The solid-state imaging device is provided with the flexible wiring board, a reinforcing plate, a solid-state imaging element substrate, a translucent member, an optical lens and a lens case. The flexible wiring board and the reinforcing plate have the same outer shapes and are integrally laminated. On the reinforcing plate, an alignment hole to be used from both the front and the rear is formed as a reference for arranging the solid-state imaging element substrate and for arranging the lens case. On the reinforcing plate, the translucent member is also arranged to cover an opening section, and the solid-state imaging element substrate and the lens case are arranged to face each other with the opening section in between, by having the alignment hole as common reference.