The present invention relates to a reversible leadless package and methods of making and using same. A semiconductor device package comprises the following components: a moulded compound which is usedfor forming a first package surface, a second package surface and one part of the package side surface; a semiconductor device which is partially covered by the moulded component at least and comprises a plurality of I/O pads which are directly electrically connected to one part of the package side surface for forming the reverse chip connection; and a conductive lead frame which comprises a plurality of pillars and a plurality of pillar extending parts. Each pillar extending part is provided with a third contact surface which is provided on the second package surface. The plurality of pillarextending parts extend from the plurality of pillars to the semiconductor device. Each of the pillar extending part comprises a junction point which is formed on the surface of the pillar extending part opposite to the second package surface. The junction point effectively separates the semiconductor device from the pillar extending parts, and at least one I/O pad is electrically connected to thepillar extending part at the junction point.